SLVSJW2 September   2025 SN74ACT165-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4.   4
  5. 3 Description
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Characteristics
    7.     14
    8. 5.7 Switching Characteristics
    9. 5.8 Typical Characteristics
  8. 6 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 TTL-Compatible CMOS Inputs
      3. 7.3.3 Wettable Flanks
      4. 7.3.4 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  10. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information

5.7 Switching Characteristics

over operating free-air temperature range(unless otherwise noted); CL = 50pF. See #i#Parameter Measurement Information
PARAMETER FROM (INPUT) TO (OUTPUT) VCC -40°C to 125°C UNIT
MIN TYP MAX
tpd CLK or CLK INH QH or QH 5V ± 0.5V 9.5 ns
SH/LD QH or QH 5V ± 0.5V 12.4 ns
H QH or QH 5V ± 0.5V 10.4 ns
CPD(1) CLK or CLK INH QH 5V 15 pF
(1) Power dissipation capacitance measured with CL = 50pF, F = 1MHz