SLVSLB8 May   2026 TLVM65030

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Descriptions
      1. 6.3.1 Output Voltage Selection
      2. 6.3.2 EN Pin and Use as VIN UVLO
      3. 6.3.3 Mode Selection
        1. 6.3.3.1 MODE/SYNC Pin Uses for Synchronization
        2. 6.3.3.2 Clock Locking
      4. 6.3.4 Adjustable Switching Frequency
      5. 6.3.5 Internal LDO, VCC UVLO, and BIAS Input
      6. 6.3.6 Bootstrap Voltage (BST Pin)
      7. 6.3.7 Soft Start and Recovery From Dropout
      8. 6.3.8 Monitoring Features
        1. 6.3.8.1 Power-Good Monitor
        2. 6.3.8.2 Overcurrent and Short-Circuit Protection
        3. 6.3.8.3 Hiccup
        4. 6.3.8.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
        1. 6.4.2.1 Peak Current Mode Operation
        2. 6.4.2.2 Auto Mode Operation
          1. 6.4.2.2.1 Diode Emulation
        3. 6.4.2.3 FPWM Mode Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Custom Design With WEBENCH® Tools
        2. 7.2.2.2 Choosing the Switching Frequency
        3. 7.2.2.3 FB for Adjustable or Fixed Output Voltage Mode
        4. 7.2.2.4 Output Capacitor Selection
        5. 7.2.2.5 Input Capacitor Selection
        6. 7.2.2.6 CBOOT
        7. 7.2.2.7 External UVLO
        8. 7.2.2.8 Maximum Ambient Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Ground and Thermal Considerations
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
      2. 8.1.2 Development Support
        1. 8.1.2.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

6.3.8.4 Thermal Shutdown

Thermal shutdown limits total power dissipation by turning off the internal switches when the IC junction temperature exceeds 165°C (typical) and power-good (PG) asserts. Thermal shutdown does not trigger below 155°C. After thermal shutdown occurs, hysteresis prevents the device from switching until the junction temperature drops to approximately 156°C. When the junction temperature falls below 156°C (typical), the TLVM65030 attempts to soft start.