SLVSMK3 June   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Headers and SMP Connectors Information
    3. 2.3 Test Points
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks

1.1 Introduction

This EVM describes the TMUXHS5212-EVM evaluation module (EVM) and the intended use. The board allows for quick prototyping and characterization of TI’s TMUXHS5212 high-speed multiplexer.

The EVM includes the following additional features:

  • Banana jack plug ins to power up the device.
  • SMP connectors on the I/Os for high-speed signaling.
  • Two 3-pin headers for logic control and channel toggling.
  • Logic and GND test points for an additional way to control the device.