SLVT229 December   2025

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 High Side Gate Drive Circuit
      2. 2.2.2 PWM Generation Circuit
    3. 2.3 Highlighted Products
      1. 2.3.1 UCC21330-Q1 Overview
      2. 2.3.2 UCC27211A-Q1 Overview
      3. 2.3.3 TPS1212-Q1 Overview
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Efficiency Data
      2. 3.3.2 Efficiency Graphs
      3. 3.3.3 Output Voltage Ripple
      4. 3.3.4 Thermal Images
      5. 3.3.5 Switch Voltage Stress of High Side Switches
      6. 3.3.6 Load Transients
      7. 3.3.7 Reverse Step-up Operation of SCC
  10. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 PCB Layout Recommendations
    2. 4.2 Documentation Support
    3.     Trademarks

3.1 Hardware Requirements

The following hardware is required for this reference design:

  • PMP41150 board

The following test equipment is needed to power and evaluate the DUT:

  • DC Source: Chroma 62012P-100-50;
  • DC Load: Chroma 6312A+63103A
  • Multimeter: Fluke 287C
  • Oscilloscope: Tektronix DPO3054
  • Electrical thermography: Fluke TiS55
A heatsink is used at the bottom side of the board. The dimension of the heatsink is shown in Figure 3-1. The groove in the heat sink is designed so that the height of the capacitors does't interfere with the installation.

Thermal interface material (TIM) needs to be applied in between the aluminum heatsink and the exposed copper plane to maintain proper contact between surfaces and also avoid direct short across different power nets.

PMP41150 Dimension of the Heatsink Figure 3-1 Dimension of the Heatsink
PMP41150 Bottom Side of PMP41150 Figure 3-2 Bottom Side of PMP41150