SLVUDA6 February   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Getting Started
    1. 2.1 Introduction
    2. 2.2 Key Features
    3. 2.3 What's Included
      1. 2.3.1 Kit Contents
      2. 2.3.2 Software Examples
    4. 2.4 Connecting to the Computer
    5. 2.5 First Steps: Out of Box Experience (OoBE)
    6. 2.6 Next Steps: Looking Into the Provided Code
  7. 3Hardware
    1. 3.1 Jumper Map
    2. 3.2 Block Diagram
    3. 3.3 Hardware Features
      1. 3.3.1 MSPM0G3218 MCU
    4. 3.4 XDS110-ET Onboard Debug Probe With EnergyTrace Technology
      1. 3.4.1 Application (or Backchannel) UART
      2. 3.4.2 Using an External Debug Probe Instead of the Onboard XDS110-ET
      3. 3.4.3 Using the XDS110-ET Debug Probe With a Different Target
      4. 3.4.4 Special Features
        1. 3.4.4.1 Thermistor
    5. 3.5 Power
      1. 3.5.1 XDS110-ET USB Power
    6. 3.6 External Power Supply and BoosterPack Plug-in Module
    7. 3.7 Measure Current Draw of the MSPM0 MCU
    8. 3.8 Clocking
    9. 3.9 BoosterPack Plug-in Module Pinout
  8. 4Software Examples
  9. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  10. 6Resources
    1. 6.1 Integrated Development Environments
      1. 6.1.1 TI Cloud Development Tools
      2. 6.1.2 TI Resource Explorer Cloud
      3. 6.1.3 Code Composer Studio Cloud
      4. 6.1.4 Code Composer Studio IDE
    2. 6.2 MSPM0 SDK and TI Resource Explorer
    3. 6.3 MSPM0G3218 MCU
      1. 6.3.1 Device Documentation
      2. 6.3.2 MSPM0G3218 Code Examples
    4. 6.4 Community Resources
      1. 6.4.1 TI E2E™ Forums
  11. 7Additional Information
    1. 7.1 Trademarks
  12. 8Revision History

2.1 Introduction

The MSPM0G3218 is Arm® 32-bit Cortex®-M0+ CPU with a memory protection unit and frequency up to 80MHz. The device features 256KB of embedded flash memory combined with 8KB data flash bank with ECC protection and 32KB total SRAM with ECC protection or hardware parity. The integrated high-performance analog peripherals include two simultaneous sampling 12-bit 1.6Msps analog-to-digital converters (ADC) with up to 27 external channels with 14-bit effective resolution at 105ksps using hardware averaging.

Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module or choose among many already available from TI and third-party developers.

Free software development tools are also available such as TI's Code Composer Studio™ IDE, IAR Embedded Workbench™ IDE, and Keil®µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology when paired with the MSPM0G3218 LaunchPad™ development kit. Developer can easily measure the power consumption of their applications. More information about the LaunchPad development kit, the supported BoosterPack™ plug-in modules, and the available resources can be found at TI's LaunchPad development kit portal. To get started quickly and find available resources in the MSPM0 software development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

See the MSPM0 Quick Reference Guide for more resources surrounding MSPM0 devices.