SLVUDI2 September   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Board Overview
    2. 2.2 Key Features
      1. 2.2.1 Processor
      2. 2.2.2 Memory and Storage
      3. 2.2.3 Interface and Peripherals
      4. 2.2.4 Expansion Connectors and Expansion Headers to Support Application-Specific Capes
    3. 2.3 Power Requirements
      1. 2.3.1 Integrated Power Architecture
      2. 2.3.2 Advanced Power Management Features
    4. 2.4 Header Information
      1. 2.4.1 Cape Expansion Headers
      2. 2.4.2 65 Possible Digital I/Os
      3. 2.4.3 PWMs and Timers
      4. 2.4.4 Analog Inputs
      5. 2.4.5 UART
      6. 2.4.6 I2C
      7. 2.4.7 SPI
    5. 2.5 Detailed Hardware Design
      1. 2.5.1 USB Interface
        1. 2.5.1.1 USB 2.0 Type-A Interface
        2. 2.5.1.2 USB 2.0 Type-C® Interface
      2. 2.5.2 Ethernet Interface
      3. 2.5.3 Power Supply Interface
      4. 2.5.4 DDR3L SDRAM Interface
      5. 2.5.5 eMMC Flash Interface
      6. 2.5.6 Micro SD Card Slot Interface
      7. 2.5.7 Grove Connector Interfaces
        1. 2.5.7.1 Grove I2C Interface (J4)
        2. 2.5.7.2 Grove UART Interface (J5)
  8. 3Hardware Design Files
    1. 3.1 Schematics, PCB Layout and BOM
  9. 4Compliance Information
    1. 4.1 Compliance – FCC Requirement
  10. 5Additional Information
    1. 5.1 Known Hardware or Software Issues
    2. 5.2 Trademarks
    3. 5.3 Brand Uses Approval
  11. 6Related Documentation

2.3 Power Requirements

The BeagleBone Green Eco is powered through a USB Type-C connector or the P9 expansion header which serves as both a power input and communications interface. The board requires a 5V power supply.

The board uses the TPS65214 Power Management IC (PMIC), an industrial-grade device engineered for exceptional efficiency and reliability. This advanced PMIC delivers comprehensive power management through a single, highly integrated device, complementing the –40°C to +85°C industrial operating temperature range of the board.