SLVUDP8 June   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Power Requirements
      1. 2.1.1 VIO
      2. 2.1.2 VSUP
    2. 2.2 Setup
      1. 2.2.1 Power and Ground
      2. 2.2.2 LIN Communication
    3. 2.3 Header and Jumper Information
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

2.3 Header and Jumper Information

Table 2-1 refers to all connectors, test points, and clips on the EVM, along with a description of the functions.

Table 2-1 Header and Jumper Hardware Information
CONNECTION TYPE DESCRIPTION
J1 2-pin header

Connection to the SLP pin

Shunt populated: Device is in Normal mode

Shunt not populated: Device is in Sleep mode
J2 2 × 8-pin header All odd-numbered pins connect to ground, even-numbered pins are RXD and TXD connections:

2 - RXD1, 4 - RXD2, 6 - RXD3, 8 - RXD4, 10 - TXD1, 12 - TXD2, 14 - TXD3, 16 - TXD4
J3 2 × 4-pin header All even-numbered pins connect to ground, odd-numbered pins are LIN bus connections:

1 - LIN4, 2 - LIN3, 3 - LIN2, 4 - LIN1
P1 Banana jack VSUP supply
P2 Banana jack VIO supply
P3 Banana jack Ground connection for EVM
TP1 Test point VSUP test point
TP2 Test point VIO test point
TP3 - TP10 Test point Ground connection test points
TP11 Test point SLP test point
TP12 Test point INHN test point
TP13 - TP16 Test point TXD test points: TP13 - TXD1, TP14 - TXD2, TP15 - TXD3, TP16 - TXD4
TP17 - TP20 Test point RXD test points: TP17 - RXD1, TP18 - RXD2, TP19 - RXD3, TP20 - RXD4
TP21 - TP24 Test point LIN test points: TP21 - LIN1, TP22 - LIN2, TP23 - LIN3, TP24 - LIN4
W1 and W2 Ground clip Clips for extra ground connections