SLVUDP8 June   2026

1.   1
2.   Description
3.   Features
4.   Applications
5.   5
6. 1Evaluation Module Overview
   1. 1.1 Introduction
   2. 1.2 Kit Contents
   3. 1.3 Specification
   4. 1.4 Device Information
7. 2Hardware
   1. 2.1 Power Requirements
      1. 2.1.1 VIO
      2. 2.1.2 VSUP
   2. 2.2 Setup
      1. 2.2.1 Power and Ground
      2. 2.2.2 LIN Communication
   3. 2.3 Header and Jumper Information
8. 3Hardware Design Files
   1. 3.1 Schematics
   2. 3.2 PCB Layouts
   3. 3.3 Bill of Materials (BOM)
9. 4Additional Information
   1. 4.1 Trademarks