SLVUE31 October   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  7. 2Hardware
    1. 2.1 Test Points
      1. 2.1.1 Key Connections
        1. 2.1.1.1 Connect a Supply to J6 Connector
        2. 2.1.1.2 PWM Input
          1. 2.1.1.2.1 Operational Mode: Single PWM
          2. 2.1.1.2.2 Operational Mode: HI LI
        3. 2.1.1.3 Dead-Time Control Resistors
        4. 2.1.1.4 Power Supply
    2. 2.2 Power-Up Procedure
      1. 2.2.1 Step 1: Driver Bias Supply
      2. 2.2.2 Step 2: Input Supply
      3. 2.2.3 Step 3: Measure SW Voltage
    3. 2.3 Power- Down Procedure
    4. 2.4 Current Sense Amplifier
    5. 2.5 Assembly Guidelines
  8. 3Implementation Results
    1. 3.1 Electrical Performance Specifications
      1. 3.1.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1.     Trademarks
  11. 6Revision History

2.5 Assembly Guidelines

Please follow the recommended assembly guidelines for the LMG1208 samples:

  • Use low temperature solder paste (like Sn42-Bi58) whose melting temperature is around 130°C-140°C.
  • Soldering using bottom side heating:
    • Recommended for thinner board (less than or equal to four layers) with no components directly underneath the device.
    • Place the solder paste as per the stencil recommendation given in the datasheet.
    • Board held on a pedestal at around 2-3cm from the top of the hot air blower and device is aligned to keep on the footprint.
  • Soldering using top-side heating:
    • This method is recommended for thicker board (more than 4 layers).
    • Use hot air gun (with temperature set to 400°C) and blow the air around the device avoiding directly above the device (temperature can be higher but used for shorter duration).
  • Look for proper soldering connection of signal pins. Remove any excess solder manually using solder iron.
  • Avoid putting excess solder paste especially near the edge of PGND pad (pin number 6).
  • If the assembly is done through automatic re flow oven, then set the temperature to less than 180°C.