SLVUE31 October   2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  7. 2Hardware
    1. 2.1 Test Points
      1. 2.1.1 Key Connections
        1. 2.1.1.1 Connect a Supply to J6 Connector
        2. 2.1.1.2 PWM Input
          1. 2.1.1.2.1 Operational Mode: Single PWM
          2. 2.1.1.2.2 Operational Mode: HI LI
        3. 2.1.1.3 Dead-Time Control Resistors
        4. 2.1.1.4 Power Supply
    2. 2.2 Power-Up Procedure
      1. 2.2.1 Step 1: Driver Bias Supply
      2. 2.2.2 Step 2: Input Supply
      3. 2.2.3 Step 3: Measure SW Voltage
    3. 2.3 Power- Down Procedure
    4. 2.4 Current Sense Amplifier
    5. 2.5 Assembly Guidelines
  8. 3Implementation Results
    1. 3.1 Electrical Performance Specifications
      1. 3.1.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1.     Trademarks
  11. 6Revision History

3.1.1 Evaluation Setup

This section describes the EVM hardware and outlines the procedure to set up for evaluation. Figure 3-1 and Figure 3-2 show the top and bottom views of the LMG1208EVM-141, respectively.

LMG1208EVM-141 LMG1208EVM-141 Board (Top View)Figure 3-1 LMG1208EVM-141 Board (Top View)
LMG1208EVM-141 LMG1208EVM-141 Board (Bottom View)Figure 3-2 LMG1208EVM-141 Board (Bottom View)

The EVM can be mounted with a heat sink (S05MZZ37, 20mm × 35mm × 10mm) to improve thermal performance. The two exposed thermal pads have a high-voltage potential difference between the pads, therefore, an electrically isolated thermal interface material (TIM) is used. TIM of GR80A-0H-50GY is placed between the device and the heat sink.

LMG1208EVM-141 Evaluation Module with Heat SinkFigure 3-3 Evaluation Module with Heat Sink