SLVUE37 October   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 System Description
      1. 1.3.1 Key System Specifications
      2. 1.3.2 End Equipment
      3. 1.3.3 Electricity Meter
      4. 1.3.4 Power Quality Meter, Power Quality Analyzer
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 System Overview
      1. 2.1.1 Block Diagram
      2. 2.1.2 Design Considerations
        1. 2.1.2.1 Voltage Measurement - Analog Front End
        2. 2.1.2.2 Current Measurement - Analog Front End
        3. 2.1.2.3 Input Voltage
        4. 2.1.2.4 XDS110 Emulator
        5. 2.1.2.5 Magnetic Tamper Detection With TMAG5273 Linear 3D Hall-Effect Sensor (Not Populated on EVM)
  9. 3Software
    1. 3.1 Metrology Overview
      1. 3.1.1 Metrology Formulas
      2. 3.1.2 UART for PC GUI Communication
      3. 3.1.3 Direct Memory Access (DMA)
      4. 3.1.4 ADC Setup
      5. 3.1.5 Foreground Process
      6. 3.1.6 Background Process
      7. 3.1.7 Software Function per_sample_dsp ()
      8. 3.1.8 Frequency Measurement and Cycle Tracking
      9. 3.1.9 LED Pulse Generation
  10. 4Implementation Results
    1. 4.1 Evaluation Procedure
      1. 4.1.1 Equipment Setup
        1. 4.1.1.1 Jumper Settings for LED and UART
        2. 4.1.1.2 Power Supply Options and Jumper Settings
      2. 4.1.2 Test Procedure
        1. 4.1.2.1 Working With the Metrology GUI
        2. 4.1.2.2 Calibration
          1. 4.1.2.2.1 Voltage and Current Offset Calibration
          2. 4.1.2.2.2 Voltage and Current Gain Calibration
          3. 4.1.2.2.3 Active Power Gain Calibration
          4. 4.1.2.2.4 Offset Calibration
          5. 4.1.2.2.5 Phase Calibration
    2. 4.2 Performance Data and Results
      1. 4.2.1 Electricity Meter Metrology Accuracy Results
      2. 4.2.2 Radiated Emissions Performance
        1. 4.2.2.1 EMI Mitigation Recommendations
  11. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Additional Information
    1. 6.1 Trademarks
  13. 7Tools and Software
  14. 8Related Documentation

4.1.1 Equipment Setup

Figure 4-1 shows the location of various components of the reference design on the top layer of the PCB. The bottom layer has no soldered components.
AMC-ADC-3PH-EVM AMC-ADC-3PH-EVM Hardware 3D View Figure 4-1 AMC-ADC-3PH-EVM Hardware 3D View