SNAS889 March   2026 LMK6B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Features Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Output Terminations
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Clocking TI Clock Buffers with the LMK6Bx
      4. 9.2.4 Application Curves
        1. 9.2.4.1 LVDS Phase Noise Curves
        2. 9.2.4.2 AC-LVPECL Phase Noise Curves
        3. 9.2.4.3 LP-HCSL Phase Noise Curves
    3. 9.3 Replacing Competitor Oscillators with the LMK6Bx
      1. 9.3.1 Replacing a LVPECL oscillator with the LMK6Bx
      2. 9.3.2 Replacing a HCSL OSC With the LMK6Bx
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Providing Thermal Reliability
        2. 9.5.1.2 Recommended Solder Reflow Profile
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data
    2. 12.2 Tape and Reel Information

9.5.1.1 Providing Thermal Reliability

The LMK6Bx is a high-performance device. Therefore, pay careful attention to device configuration and printed circuit board (PCB) layout with respect to power consumption. The ground pin must be connected to the ground plane of the PCB through three vias or more to maximize thermal dissipation out of the package.

Equation 1 describes the relationship between the PCB temperature around the LMK6Bx and the junction temperature.

Equation 1. TB = TJ – ΨJB × P

where

  • TB: PCB temperature around the LMK6Bx
  • TJ: Junction temperature of LMK6Bx
  • ΨJB: Junction-to-board thermal resistance parameter of LMK6Bx (refer to the Thermal Information tables in the Section 6 section for this information)
  • P: On-chip power dissipation of LMK6Bx