SNAS889 March   2026 LMK6B

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Features Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Output Terminations
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Clocking TI Clock Buffers with the LMK6Bx
      4. 9.2.4 Application Curves
        1. 9.2.4.1 LVDS Phase Noise Curves
        2. 9.2.4.2 AC-LVPECL Phase Noise Curves
        3. 9.2.4.3 LP-HCSL Phase Noise Curves
    3. 9.3 Replacing Competitor Oscillators with the LMK6Bx
      1. 9.3.1 Replacing a LVPECL oscillator with the LMK6Bx
      2. 9.3.2 Replacing a HCSL OSC With the LMK6Bx
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Providing Thermal Reliability
        2. 9.5.1.2 Recommended Solder Reflow Profile
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Mechanical Data
    2. 12.2 Tape and Reel Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Device Supply Voltage(2) –0.3 3.7 V
EN Logic Input Voltage –0.3 VDD + 0.3 V
OUTP, OUTN Clock Output Voltage(3) –0.3 VDD + 0.3 V
TJ Junction Temperature 140 ℃
TSTG Storage Temperature –65 150 ℃
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) For all devices with Recommended Operating Voltage of 2.5 V +/- 5% and 3.3 V +/- 5%
(3) For all differential output types.