SNAS935C March   2025  – July 2026 CDC6C-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Bulk Acoustic Wave (BAW)
      2. 8.3.2  Device Block-Level Description
      3. 8.3.3  Function Pin
      4. 8.3.4  Clock Output Interfacing and Termination
      5. 8.3.5  CDC6Cx-Q1 CISPR25 Radiated Emission Performance
        1. 8.3.5.1 EMI Reduction and Slow Mode Options
      6. 8.3.6  Temperature Stability
      7. 8.3.7  Frequency Aging
      8. 8.3.8  Mechanical Robustness
      9. 8.3.9  Wettable Flanks
      10. 8.3.10 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Features

  • AEC Q-100 qualified:
    • Device temperature grade 1: –40°C to +125°C
  • Functional Safety-Capable:
  • LVCMOS output oscillator supporting frequency range from 250kHz to 200MHz
  • Supply voltage supports 1.8V to 3.3V ±10%.
  • Very low power consumption: 4.57mA typical and 7.9mA maximum for 25MHz at 1.8V
  • Stand by current 1.5µA typical at 1.8V helps for battery powered applications
  • Low jitter: < 750fs RMS jitter for Fout ≥ 10MHz
  • Smallest industry wettable flank standard package: 1.60mm × 1.20mm (DLY), 2.00mm × 1.60mm (DLR), 2.5mm × 2.00mm (DLF), 3.20mm × 2.5mm (DLN)
    • Universal land pattern footprint under Mechanical, Packaging, and Orderable Information
  • Integrated LDO for robust supply noise immunity
  • Start-up time < 3ms
    • Contact TI for different start-up times.
  • Orderable options for slow rise and fall time for EMI reduction
  • Supported frequencies (MHz):
    • 1.2, 2.048, 4, 5.12, 6.78, 8, 8.192, 10, 12, 12.288, 16, 19.2, 20, 24, 24.576, 25, 26, 27, 30, 33.33, 33.333, 38.4, 40, 48, 50, 66.666, 76.8, 100, 125, 156.25, and more
  • Contact TI representative for any frequency and samples needed.