SNAS935C March   2025  – July 2026 CDC6C-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Bulk Acoustic Wave (BAW)
      2. 8.3.2  Device Block-Level Description
      3. 8.3.3  Function Pin
      4. 8.3.4  Clock Output Interfacing and Termination
      5. 8.3.5  CDC6Cx-Q1 CISPR25 Radiated Emission Performance
        1. 8.3.5.1 EMI Reduction and Slow Mode Options
      6. 8.3.6  Temperature Stability
      7. 8.3.7  Frequency Aging
      8. 8.3.8  Mechanical Robustness
      9. 8.3.9  Wettable Flanks
      10. 8.3.10 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

3 Description

Texas Instruments' high-precision bulk-acoustic wave (BAW) micro-resonator technology is integrated directly into a package allowing for low jitter clock circuitry. BAW is fully designed and manufactured at TI factories like other silicon-based fabrication processes.

The CDC6Cx-Q1 device is a low jitter, low-power, fixed-frequency oscillator which incorporates the BAW as the resonator source. The device is factory-programmed per specific frequency and function pin. With a frequency control logic and output frequency divider, the CDC6Cx-Q1 can produce any frequency within the specified range, providing one device family for all frequency needs.

The high-performance clocking, mechanical stability, lower power consumption, flexibility, and small package options for this device are designed for reference clock and core clocks in automotive applications.

Packaging Information
PART NUMBER OUTPUT TYPE PACKAGE(1) PACKAGE SIZE(2)
CDC6Cx-Q1 LVCMOS

VSON (DLN, 4)

 3.20mm × 2.50mm
VSON (DLF, 4) 2.50mm × 2.00mm

VSON (DLR, 4)

 2.00mm × 1.60mm
VSON (DLY, 4) 1.60mm × 1.20mm
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
CDC6C-Q1 CDC6Cx-Q1 Simplified Block Diagram CDC6Cx-Q1 Simplified Block Diagram