SNLS505H July   2016  – July 2026 DP83822H , DP83822HF , DP83822I , DP83822IF

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, Power-Up Timing
    7. 6.7  Timing Requirements, Power-Up With Unstable XI Clock
    8. 6.8  Timing Requirements, Reset Timing
    9. 6.9  Timing Requirements, Serial Management Timing
    10. 6.10 Timing Requirements, 100Mbps MII Transmit Timing
    11. 6.11 Timing Requirements, 100Mbps MII Receive Timing
    12. 6.12 Timing Requirements, 10Mbps MII Transmit Timing
    13. 6.13 Timing Requirements, 10Mbps MII Receive Timing
    14. 6.14 Timing Requirements, RMII Transmit Timing
    15. 6.15 Timing Requirements, RMII Receive Timing
    16. 6.16 Timing Requirements, RGMII
    17. 6.17 Normal Link Pulse Timing
    18. 6.18 Auto-Negotiation Fast Link Pulse (FLP) Timing
    19. 6.19 10BASE-Te Jabber Timing
    20. 6.20 100BASE-TX Transmit Latency Timing
    21. 6.21 100BASE-TX Receive Latency Timing
    22. 6.22 Timing Diagrams
    23. 6.23 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Energy Efficient Ethernet
        1. 7.3.1.1 EEE Overview
        2. 7.3.1.2 EEE Negotiation
      2. 7.3.2 Wake-on-LAN Packet Detection
        1. 7.3.2.1 Magic Packet Structure
        2. 7.3.2.2 Magic Packet Example
        3. 7.3.2.3 Wake-on-LAN Configuration and Status
      3. 7.3.3 Start of Frame Detect for IEEE 1588 Time Stamp
      4. 7.3.4 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1  MAC Interfaces
        1. 7.4.1.1 Media Independent Interface (MII)
        2. 7.4.1.2 Reduced Media Independent Interface (RMII)
        3. 7.4.1.3 RMII Repeater Mode
        4. 7.4.1.4 Reduced Gigabit Media Independent Interface (RGMII)
      2. 7.4.2  Serial Management Interface
        1. 7.4.2.1 Extended Register Space Access
        2. 7.4.2.2 Write Address Operation
        3. 7.4.2.3 Read Address Operation
        4. 7.4.2.4 Write (No Post Increment) Operation
        5. 7.4.2.5 Read (No Post Increment) Operation
        6. 7.4.2.6 Write (Post Increment) Operation
        7. 7.4.2.7 Read (Post Increment) Operation
        8. 7.4.2.8 Example Write Operation (No Post Increment)
        9. 7.4.2.9 Example Read Operation (No Post Increment)
      3. 7.4.3  100BASE-TX
        1. 7.4.3.1 100BASE-TX Transmitter
          1. 7.4.3.1.1 Code-Group Encoding and Injection
          2. 7.4.3.1.2 Scrambler
          3. 7.4.3.1.3 NRZ to NRZI Encoder
          4. 7.4.3.1.4 Binary to MLT-3 Converter
        2. 7.4.3.2 100BASE-TX Receiver
      4. 7.4.4  100BASE-FX
        1. 7.4.4.1 100BASE-FX Transmit
        2. 7.4.4.2 100BASE-FX Receive
      5. 7.4.5  10BASE-Te
        1. 7.4.5.1 Squelch
        2. 7.4.5.2 Normal Link Pulse Detection and Generation
        3. 7.4.5.3 Jabber
        4. 7.4.5.4 Active Link Polarity Detection and Correction
      6. 7.4.6  Auto-Negotiation (Speed / Duplex Selection)
      7. 7.4.7  Auto-MDIX Resolution
      8. 7.4.8  Loopback Modes
        1. 7.4.8.1 Near-End Loopback
        2. 7.4.8.2 MII Loopback
        3. 7.4.8.3 PCS Loopback
        4. 7.4.8.4 Digital Loopback
        5. 7.4.8.5 Analog Loopback
        6. 7.4.8.6 Far-End (Reverse) Loopback
      9. 7.4.9  BIST Configurations
      10. 7.4.10 Cable Diagnostics
        1. 7.4.10.1 TDR
      11. 7.4.11 Fast Link Down Functionality
    5. 7.5 Programming
      1. 7.5.1 Hardware Bootstrap Configurations
      2. 7.5.2 LED Configuration
      3. 7.5.3 PHY Address Configuration
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPI Network Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Fiber Network Circuit
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 Clock Requirements
            1. 9.2.2.1.1.1 Oscillator
            2. 9.2.2.1.1.2 Crystal
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 MII Layout Guidelines
          2. 9.2.2.2.2 RMII Layout Guidelines
          3. 9.2.2.2.3 RGMII Layout Guidelines
          4. 9.2.2.2.4 MDI Layout Guidelines
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supply Characteristics
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Transformer Layout
          1. 9.4.1.3.1 Transformer Recommendations
        4. 9.4.1.4 Metal Pour
        5. 9.4.1.5 PCB Layer Stacking
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.5.2 LED Configuration

The DP83822 supports up to three configurable Light Emitting Diode (LED) pins: LED_0, LED_1 (GPIO1), COL (GPIO2) and RX_D3 (GPIO3). Several functions can be multiplexed onto the LEDs for different modes of operation. The LED configuration modes are selected using the LEDs Configuration Register (LEDCFG1, register 0x0460) and the Multi-LED Control Register (MLEDCR, register 0x0025). LED_0 and COL (GPIO2) use the MLED function found in register 0x0025. MLED can be routed to only one of these two pins at a time. MLED routing is determined by bits[1:0] in register 0x0025.

Because LED pins are also used as bootstrap pins, external components must be considered to avoid contention. LED pins are automatically configured for the proper polarity based on the bootstrap configuration at power up or hardware reset. If an LED pin is resistively pulled low, the corresponding output is configured as an active high driver. Conversely, if a given bootstrap input is resistively pulled high, the corresponding output is configured as an active low driver.

Figure 7-13 shows proper bootstrap connections for LED pins using either pullup or pulldown configurations.

Note: LED_0 and LED_1 require parallel pullup or pulldown resistors when using the pin in conjunction with an LED and current limiting resistor. An Rp of 1.96kΩ to 2.49kΩ resistor must be used as the parallel pull resistor. When LED pins are not used, the pins can be left floating.

DP83822HF DP83822IF DP83822H DP83822I Example Strap Connections Figure 7-13 Example Strap Connections