SNVS089P July   2000  – September 2026 LM3488

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings: LM3488
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Slope Compensation Ramp
      2. 6.3.2 Frequency Adjust, Synchronization, Shutdown
      3. 6.3.3 Short-Circuit Protection
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Boost Converter
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 7.2.1.2.2 Power Inductor Selection
          3. 7.2.1.2.3 Programming the Output Voltage
          4. 7.2.1.2.4 Setting the Current Limit
          5. 7.2.1.2.5 Current Limit With External Slope Compensation
          6. 7.2.1.2.6 Power Diode Selection
          7. 7.2.1.2.7 Power MOSFET Selection
          8. 7.2.1.2.8 Input Capacitor Selection
          9. 7.2.1.2.9 Output Capacitor Selection
        3. 7.2.1.3 Application Curve
      2. 7.2.2 Designing SEPIC Using LM3488
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Power MOSFET Selection
          2. 7.2.2.2.2 Power Diode Selection
          3. 7.2.2.2.3 Selection Of Inductors L1 and L2
          4. 7.2.2.2.4 Sense Resistor Selection
          5. 7.2.2.2.5 SEPIC Capacitor Selection
          6. 7.2.2.2.6 Input Capacitor Selection
          7. 7.2.2.2.7 Output Capacitor Selection
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision O (July 2015) to Revision P (September 2026)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Removed LM3488Q-Q1 automotive information from the data sheetGo
  • Changed RθJA from 160 to 151.2°C/WGo
  • Changed RθJC(top) from 50 to 45.3°C/WGo
  • Changed RθJB from 77 to 85.6°C/WGo
  • Changed ψJT from 4.7 to 1.5°C/WGo
  • Changed ψJB from 76 to 84.2°C/WGo
  • Changed maximum IEAO (source) from 140 to 170µA (25°C)Go
  • Changed maximum IEAO (source) from 180 to 220μAGo
  • Changed minimum IEAO (sink) from −100 to −70μA (25°C)Go
  • Changed minimum IEAO (sink) from −85 to −60μAGo

Changes from Revision N (September 2014) to Revision O (July 2015)

  • Changed Datasheet title Go

Changes from Revision M (March 2013) to Revision N (September 2014)

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed ESD Table and Features sectionGo
  • Changed application information. Go

Changes from Revision L (March 2013) to Revision M (March 2013)

  • Changed layout of National Data Sheet to TI formatGo