SNVSCS6 March   2026 TPS7H1301-SP

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Quality Conformance Inspection
    7. 7.7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Enable
      2. 9.3.2  Charge Pump
        1. 9.3.2.1 Charge Pump Operation
        2. 9.3.2.2 Foldback Switching
      3. 9.3.3  Startup
      4. 9.3.4  Power Good
      5. 9.3.5  Output Voltage
      6. 9.3.6  Dropout
      7. 9.3.7  Output Voltage Accuracy
      8. 9.3.8  Output Noise
      9. 9.3.9  Power Supply Rejection Ratio
      10. 9.3.10 Stability
        1. 9.3.10.1 Stability of the TPS7H1301
        2. 9.3.10.2 Stability of the TPS7H1302
      11. 9.3.11 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable Disable
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Capacitor Selection
          1. 10.2.2.1.1 Input Capacitor (CIN) Selection
          2. 10.2.2.1.2 CFLY
          3. 10.2.2.1.3 CPOUT Capacitor
          4. 10.2.2.1.4 Bypass Capacitors
          5. 10.2.2.1.5 Output Capacitor
        2. 10.2.2.2 Charge Pump Output Resistance
        3. 10.2.2.3 Output Noise
        4. 10.2.2.4 PSRR Design Implications
        5. 10.2.2.5 Stability Design Considerations
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1.     69
10.2.2.1.1 Input Capacitor (CIN) Selection

TI recommends placing a 10μF 25V (or higher) ceramic capacitor as close as possible to the input pin of the TPS7H130x; additional capacitance and bypass capacitance are considered optional.

The input capacitor (CIN) serves as a charge reservoir that facilitates rapid charge transfer from the supply to the flying capacitors during the charge phase. This capacitor prevents input voltage sag at the beginning of each charge phase when flying capacitors connect to the input. Additionally, the input capacitor filters input noise, protecting sensitive internal analog circuitry that derives bias from the input line.

Effect on Input Ripple

Input capacitance has a direct and proportional relationship with input voltage ripple:

  • Increasing input capacitance → Proportionally decreases input voltage ripple
  • Decreasing input capacitance → Proportionally increases input voltage ripple