SNVSCU9B May   2025  – April 2026 TPS7H4012-SEP , TPS7H4012-SP , TPS7H4013-SEP , TPS7H4013-SP

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Device Options Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Quality Conformance Inspection
    7. 7.7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 VIN and Power VIN Pins (VIN and PVIN)
      2. 9.3.2 Voltage Reference
      3. 9.3.3 Voltage Sensing and Setting VOUT
        1. 9.3.3.1 Minimum Output Voltage
        2. 9.3.3.2 Maximum Output Voltage
      4. 9.3.4 Enable
      5. 9.3.5 Power Good (PWRGD)
      6. 9.3.6 Adjustable Switching Frequency and Synchronization
        1. 9.3.6.1 Internal Clock Mode
        2. 9.3.6.2 External Clock Mode
      7. 9.3.7 Turn-On Behavior
        1. 9.3.7.1 Soft-Start (SS_TR)
        2. 9.3.7.2 Safe Start-Up Into Prebiased Outputs
        3. 9.3.7.3 Tracking and Sequencing
      8. 9.3.8 Protection Modes
        1. 9.3.8.1 Overcurrent Protection
          1. 9.3.8.1.1 High-Side 1 Overcurrent Protection (HS1)
          2. 9.3.8.1.2 High-Side 2 Overcurrent Protection (HS2)
          3. 9.3.8.1.3 COMP Shutdown
          4. 9.3.8.1.4 Low-Side Overcurrent Sinking Protection
        2. 9.3.8.2 Output Overvoltage Protection (OVP)
        3. 9.3.8.3 Thermal Shutdown
      9. 9.3.9 Error Amplifier and Loop Response
        1. 9.3.9.1 Error Amplifier
        2. 9.3.9.2 Power Stage Transconductance
        3. 9.3.9.3 Slope Compensation
        4. 9.3.9.4 Frequency Compensation
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1  Operating Frequency
        2. 10.2.2.2  Output Inductor Selection
        3. 10.2.2.3  Output Capacitor Selection
        4. 10.2.2.4  Input Capacitor Selection
        5. 10.2.2.5  Soft-Start Capacitor Selection
        6. 10.2.2.6  Rising VIN Set Point (Configurable UVLO)
        7. 10.2.2.7  Output Voltage Feedback Resistor Selection
        8. 10.2.2.8  Output Voltage Accuracy
        9. 10.2.2.9  Slope Compensation Requirements
        10. 10.2.2.10 Compensation Component Selection
        11. 10.2.2.11 Schottky Diode
      3. 10.2.3 Application Curve
      4. 10.2.4 Inverting Buck-Boost
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1.     82

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.