SNVU857 November   2023 LMR66430-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 Test Points
      2. 2.1.2 Jumpers
    2. 2.2 Operation
      1. 2.2.1 Quick Start
  8. 3Implementation Results
    1. 3.1 Test Results
      1. 3.1.1 LMR66430-2EVM Test Results
        1. 3.1.1.1 Noise and Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1.     Trademarks

4.2 PCB Layout

GUID-20231026-SS0I-VWFJ-9L5G-8NPJNL70DN6W-low.png Figure 4-4 Top View of EVM
GUID-20231026-SS0I-TZN3-8XTX-5QZMCDGBPBG1-low.png Figure 4-5 EVM Top Copper Layer
GUID-20231026-SS0I-XQQB-69S5-497G3HS8QZDQ-low.png Figure 4-6 Mid-Layer One
GUID-20231026-SS0I-F8NZ-KC3W-GMLBSVMN6XSQ-low.png Figure 4-7 Mid-Layer Two
GUID-20231026-SS0I-NNV5-QBH1-DBWM09SVWZWK-low.png Figure 4-8 EVM Bottom Copper Layer
GUID-20231026-SS0I-RCPZ-SQVJ-VGKQNQ34NVRJ-low.png Figure 4-9 Bottom View of EVM