SNVU857 November   2023 LMR66430-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 Test Points
      2. 2.1.2 Jumpers
    2. 2.2 Operation
      1. 2.2.1 Quick Start
  8. 3Implementation Results
    1. 3.1 Test Results
      1. 3.1.1 LMR66430-2EVM Test Results
        1. 3.1.1.1 Noise and Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1.     Trademarks

3.1.1.1 Noise and Thermal Performance

Conducted Emissions

The LMR66430-2EVM was evaluated on a CISPR 25, Class 5, pre-compliance, conducted emissions (CE) setup. The LMR66430-2EVM was evaluated with a 13.5V input supply and 3 A resistive load. CISPR 25, Class 5, CE scan (150kHz to 108MHz) provides the scan results showing a passing result by approximately 10 dB for both average and peak detect.

GUID-20231026-SS0I-NVXF-BLRK-QBPJ6TVQ4ZGK-low.svg Figure 3-1 CISPR 25, Class 5, CE scan (150kHz to 108MHz)

Thermal Capture

The LMR66430-2EVM was evaluated with a 13.5V input and a resistive load. Thermal capture with 2 A Load and Thermal capture with 3 A Load demonstrate the case, temperature rise from room temperature (25°C). This gives a good approximation to the junction temperature with the temperature gradient being very small across the thin case and junction.

GUID-20231026-SS0I-CF1P-D86Z-F6W9VVBKTJNF-low.png Figure 3-2 Thermal capture with 2 A Load
GUID-20231026-SS0I-QD02-G5TX-LBMP6G5R1RRZ-low.png Figure 3-3 Thermal capture with 3 A Load