1. Traditional Cored Hall: Low component cost, but structural tooling and complex assembly, bulky structure drive total system costs higher. Field failures from mounting drift add after-sales overhead.
2. Coreless Hall: Eliminate cores, brackets and insulating hardware, delivering equivalent or lower total BOM cost. Streamlined assembly to keep the mass manufacturing economics.

Research and development investment: Cored sensors center on part selection; coreless designs require preliminary magnetic simulation and busbar layout tuning. However, TI's reference designs, simulation tools and evaluation kits support lower development barriers. For more information, visit TMCS2100-Q1.