SPRT838 July   2026 TMCS2100-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Industry Pain Points: Bottlenecks of Traditional Cored Hall Schemes
  5. 2Comprehensive Comparison: TI Coreless Hall versus Traditional Cored Hall
    1. 2.1 Fundamental Architectural Differences
    2. 2.2 Key Performance and Engineering Pain Point Comparison Table
    3. 2.3 Cost and Research and Development Investment Breakdown
  6. 3Advantages of TI Coreless Hall
  7. 4Conclusion
  8. 5References

3 Advantages of TI Coreless Hall

  1. Eliminate core limitations for dynamic performance: Removing ferromagnetic cores erases magnetic saturation, hysteresis and remanence as error sources. During motor start-up transients, high-power charge/discharge cycles or instantaneous server load spikes, current waveforms remain undistorted, with fast, reliable short-circuit/overcurrent protection free from core-induced latency or failure. Integrated high-speed signal conditioning enables 250kHz bandwidth and <1us fault response, matching high di/dt and dv/dt operating conditions and enabling fast closed-loop control.
  2. Ultra-Compact, Lightweight Form Factor Frees Mechanical Design: Without cores, mounting frames and through-hole clearance requirements, TI coreless Hall sensors use standard surface-mount packages that solder directly to power PCBs or mount flush alongside high-current copper busbars without drilling. For equivalent current ranges, footprint shrinks over 60% and mass drops drastically, creating room for thermal routing, high-voltage insulation and connectors—critical for automotive traction controllers and dense AI server power supplies, which can further to improve the system power density.
  3. Multiple sensor combination Architecture Suppresses Inter-Phase crosstalk compared with traditional coreless designs. Generic coreless sensors struggle with crosstalk from neighboring busbars; TI multiple signal combination architecture distinguishes in-phase magnetic field and crosstalk magnetic field. Real-time frequency detection and compensation to eliminate the frequency effect (skin effect and proximity effect) on the 3-phase busbar. Dense inverter and energy storage converter layouts maintain rated accuracy without external shielding, easing EMC engineering.
  4. Better displacement error performance compared with traditional coreless designs. For each phase, 2 TI coreless current sensors at different locations are used to measure the magnetic field at the same time, which offers more information about the total magnetic field and therefore allows the TI design to be more robust with cross-talk and displacement errors. TI recommends leaving 3mm-11mm distance between the busbar and device, for both insulation requirement and better SNR, which is shown in Figure 3. Based on this structure, any vibration on the vehicle causing the distance changing has minimum impact on the magnetic field amplitude, adding very limited error on the sensor output.
    Installation Instructions Figure 3 Installation Instructions
  5. Quick EOL calibration and ease of use

TI coreless current sensor only requires characterization in the lab at researching stage. After finishing this characterization, all characterized register data can be uploaded with MCU for every platform with the same mechanical structure. The simple calibration is needed for EOL production due to assembly tolerance, requiring simple gain/offset optimizing with either customized calibration method or TI calibration process, consuming truly short time to save cost on the production stage.