Abstract

With the widespread adoption of SiC/GaN high-frequency power devices, equipment for electric vehicles, energy storage PCS, AI server power supplies, and photovoltaic inverters continues to iterate toward miniaturization, high power density, and high-speed protection. Traditional cored Hall sensors face growing constraints including magnetic saturation, hysteresis, bulk size, and assembly tolerance. TI Coreless Hall current sensors eliminate the flux-concentrating core, leveraging multiple signal combination, on-chip calibration and compensation, and a stray field rejection algorithm to address these pain points, emerging as a leading sampling architecture for next-generation current sensing.