TIDUF23 may   2023

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1  UCC5880-Q1
      2. 2.3.2  AM2634-Q1
      3. 2.3.3  TMS320F280039C-Q1
      4. 2.3.4  UCC14240-Q1
      5. 2.3.5  UCC12051-Q1
      6. 2.3.6  AMC3330-Q1
      7. 2.3.7  TCAN1462-Q1
      8. 2.3.8  ISO1042-Q1
      9. 2.3.9  ALM2403-Q1
      10. 2.3.10 LM5158-Q1
      11. 2.3.11 LM74202-Q1
    4. 2.4 System Design Theory
      1. 2.4.1 Microcontrollers
        1. 2.4.1.1 Microcontroller – C2000™
        2. 2.4.1.2 Microcontroller – Sitara™
      2. 2.4.2 Isolated Bias Supply
      3. 2.4.3 Power Tree
        1. 2.4.3.1 Introduction
        2. 2.4.3.2 Power Tree Block Diagram
        3. 2.4.3.3 12 V Distribution and Control
        4. 2.4.3.4 Gate Drive Supply
        5. 2.4.3.5 5-Volt Supply Domain
        6. 2.4.3.6 Current and Position Sensing Power
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
      1. 3.1.1 Hardware Board Overview
        1. 3.1.1.1 Control Board
        2. 3.1.1.2 MCU Control Card – Sitara™
        3. 3.1.1.3 MCU Control Card – C2000™
        4. 3.1.1.4 Gate Driver and Bias Supply Board
        5. 3.1.1.5 DC Bus Voltage Sense
        6. 3.1.1.6 SiC Power Module
          1. 3.1.1.6.1 XM3 SiC Power Module
          2. 3.1.1.6.2 Module Power Terminals
          3. 3.1.1.6.3 Module Signal Terminals
          4. 3.1.1.6.4 Integrated NTC Temperature Sensor
        7. 3.1.1.7 Laminated Busing and DC Bus Capacitors
          1. 3.1.1.7.1 Discharge PCB
    2. 3.2 Test Setup
      1. 3.2.1 Software Setup
        1. 3.2.1.1 Code Composer Studio Project
        2. 3.2.1.2 Software Structure
    3. 3.3 Test Procedure
      1. 3.3.1 Project Setup
      2. 3.3.2 Running the Application
    4. 3.4 Test Results
      1. 3.4.1 Isolated Bias Supply
      2. 3.4.2 Isolated Gate Driver
      3. 3.4.3 Inverter System
  9. 4General Texas Instruments High Voltage Evaluation (TI HV EVM) User Safety Guidelines
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Layout Prints
      4. 5.1.4 Altium Project
      5. 5.1.5 Gerber Files
      6. 5.1.6 Assembly Drawings
    2. 5.2 Tools and Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5. 5.5 Trademarks
  11. 6Terminology

1.1 Key System Specifications

The key system specifications are summarized in Table 1-1.

Table 1-1 Key System Specifications
Parameter Specifications (units) Notes
Pout 300 kW Rated output power
VDSmax 1200 V Maximum Dain-Source Voltage
VDC 800 V DC bus voltage recommended
IDC 300 A DC Bus current
fswmax 60 kHz Based on the gate driver bias power
IL 360 A AC output RMS current
LPL 5.3 nH Parasitic Inductance including DC link capacitors and Bus bar
CDC 300 uF DC link capacitor
LDC 3.5 nH DC Bus capacitor ESL
Power Density 32 kW/L
Dimensions 28 cm x 29 cm x 11.5 cm
Weight 6.2 kg
Volume 9.3 L
Area 812 cm2
P 5 bar Coolant Operating Pressure

∆P

200 mbar

Pressure Drop
  • For information on the isolated gate driver, please refer to UCC5880-Q1 data sheet.
  • For information on the Microcontroller, please refer to AM2634-Q1 and TMSF280039C-Q1 data sheet.
  • For information on the bias supply, please refer to UCC14240-Q1 data sheet.
  • For information on the integrated modules, please reference the CAB450M12XM3 data sheet.
  • For higher ambient temperatures, the DC-Link voltage and DC-Link current must be de-rated according to the included DC-Link capacitor ratings. Please refer to the 1100 V / 100 μF CX100µ1100d51KF6 data sheet provided by FTCAP GmbH for more detailed information.
  • The included cold plate is a Wieland MicroCool CP3012-XP. To calculate the thermal resistance (°C/W) and pressure drop (bar) versus flow rate (liters/min.), please refer to the CP3012-XP data sheet provided by Wieland MicroCool Inc. for more detailed information.
  • The included current sensor board uses the LEM LF 510-S. Please refer to the LF 510-S data sheet provided by LEM USA Inc. for more detailed information.