TIDUFK3 September   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Part Selection
      2. 2.2.2 Flexible Platform Approach
    3. 2.3 Highlighted Products
      1. 2.3.1  TPS7H6101-SEP
      2. 2.3.2  F28377D-SEP
      3. 2.3.3  INA901-SP
      4. 2.3.4  TMP9R00-SP
      5. 2.3.5  TPS7H502x-SP/SEP
      6. 2.3.6  TL1431-SP
      7. 2.3.7  TPS7H1121-SP and TPS7H1121-SEP
      8. 2.3.8  TPS7A4501-SP
      9. 2.3.9  SN54SLC8T245-SEP
      10. 2.3.10 INA240A1
  8. 3System Design Theory
    1. 3.1 Power Stage Design
    2. 3.2 Current Sense
    3. 3.3 Temperature Monitoring
    4. 3.4 PCB Layer Stack
    5. 3.5 Optimizations or Trade-offs
      1. 3.5.1 Board Area Savings and Component Count Reduction
      2. 3.5.2 Signal Ringing / EMI Reduction
      3. 3.5.3 Heat Dissipation
      4. 3.5.4 Cost
  9. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software
      1. 4.2.1 Running the Matlab Simulink Model
      2. 4.2.2 Software Adaptations
    3. 4.3 Test Setup
    4. 4.4 Connecting the F28379D Launchpad
    5. 4.5 Test Results
      1. 4.5.1 Dead Times
      2. 4.5.2 Ringing on Switch Node
      3. 4.5.3 Thermal Images
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Layout Prints
    2. 5.2 Tools and Software
      1. 5.2.1 Tools
      2. 5.2.2 Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5.     Trademarks
  11. 6About the Author

2.2.1 Part Selection

A key consideration in component selection is scalability across mission radiation profiles. All the chosen power management devices have pin-to-pin compatible QML-P equivalents, which enables seamless scaling from lower radiation environments to higher radiation environments without board redesign or layout modifications. This strategy can help reduce development costs since a single PCB design can support multiple mission profiles. By maintaining electrical compatibility across the radiation tolerance range, this design can be rapidly adapted to meet different mission requirements while preserving the base architecture for reference.