TIDUFK3 September   2026

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6. 1System Description
    1. 1.1 Terminology
    2. 1.2 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
      1. 2.2.1 Part Selection
      2. 2.2.2 Flexible Platform Approach
    3. 2.3 Highlighted Products
      1. 2.3.1  TPS7H6101-SEP
      2. 2.3.2  F28377D-SEP
      3. 2.3.3  INA901-SP
      4. 2.3.4  TMP9R00-SP
      5. 2.3.5  TPS7H502x-SP/SEP
      6. 2.3.6  TL1431-SP
      7. 2.3.7  TPS7H1121-SP and TPS7H1121-SEP
      8. 2.3.8  TPS7A4501-SP
      9. 2.3.9  SN54SLC8T245-SEP
      10. 2.3.10 INA240A1
  8. 3System Design Theory
    1. 3.1 Power Stage Design
    2. 3.2 Current Sense
    3. 3.3 Temperature Monitoring
    4. 3.4 PCB Layer Stack
    5. 3.5 Optimizations or Trade-offs
      1. 3.5.1 Board Area Savings and Component Count Reduction
      2. 3.5.2 Signal Ringing / EMI Reduction
      3. 3.5.3 Heat Dissipation
      4. 3.5.4 Cost
  9. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software
      1. 4.2.1 Running the Matlab Simulink Model
      2. 4.2.2 Software Adaptations
    3. 4.3 Test Setup
    4. 4.4 Connecting the F28379D Launchpad
    5. 4.5 Test Results
      1. 4.5.1 Dead Times
      2. 4.5.2 Ringing on Switch Node
      3. 4.5.3 Thermal Images
  10. 5Design and Documentation Support
    1. 5.1 Design Files
      1. 5.1.1 Schematics
      2. 5.1.2 BOM
      3. 5.1.3 PCB Layout Recommendations
        1. 5.1.3.1 Layout Prints
    2. 5.2 Tools and Software
      1. 5.2.1 Tools
      2. 5.2.2 Software
    3. 5.3 Documentation Support
    4. 5.4 Support Resources
    5.     Trademarks
  11. 6About the Author

3.5 Optimizations or Trade-offs

The power stage design leaves further design optimizations in case improvements are needed in one or more of the following areas: