SNAS558M February   2000  – July 2016 LMC555

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Low-Power Dissipation
      2. 8.3.2 Various Packages and Compatibility
      3. 8.3.3 Operates in Both Astable and Monostable Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Monostable Operation
      2. 8.4.2 Astable Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Frequency Divider
      1. 9.3.1 Design Requirements
      2. 9.3.2 Application Curve
    4. 9.4 Pulse Width Modulator
      1. 9.4.1 Design Requirements
      2. 9.4.2 Application Curve
    5. 9.5 Pulse Position Modulator
      1. 9.5.1 Design Requirements
      2. 9.5.2 Application Curve
    6. 9.6 50% Duty Cycle Oscillator
      1. 9.6.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation SupportChanged layout of National Semiconductor Data Sheet to TI format
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Industry's Fastest Astable Frequency of 3 MHz
  • Available in Industry's Smallest 8-Bump DSBGA Package (1.43mm × 1.41mm)
  • Less Than 1 mW Typical Power Dissipation at 5 V Supply
  • 1.5 V Supply Operating Voltage Ensured
  • Output Fully Compatible With TTL and CMOS Logic at 5 V Supply
  • Tested to −10 mA, 50 mA Output Current Levels
  • Reduced Supply Current Spikes During Output Transitions
  • Extremely Low Reset, Trigger, and Threshold Currents
  • Excellent Temperature Stability
  • Pin-for-Pin Compatible With 555 Series of Timers

2 Applications

  • Precision Timing
  • Pulse Generation
  • Sequential Timing
  • Time Delay Generation
  • Pulse Width Modulation
  • Pulse Position Modulation
  • Linear Ramp Generators

3 Description

The LMC555 device is a CMOS version of the industry standard 555 series general-purpose timers. In addition to the standard package (SOIC, VSSSOP, and PDIP) the LMC555 is also available in a chip-sized package (8-bump DSBGA) using TI's DSBGA package technology. The LMC555 offers the same capability of generating accurate time delays and frequencies as the LM555 but with much lower power dissipation and supply current spikes. When operated as a one-shot, the time delay is precisely controlled by a single external resistor and capacitor. In the astable mode the oscillation frequency and duty cycle are accurately set by two external resistors and one capacitor. The use of TI's LMCMOS process extends both the frequency range and the low supply capability.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
LMC555 SOIC (8) 4.90 mm × 3.91 mm
VSSOP (8) 3.00 mm × 3.00 mm
PDIP (8) 9.81 mm × 6.35 mm
DSBGA (8) 1.43 mm × 1.41 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Pulse Width Modulator

LMC555 866920.png

Pulse Width Modulator Waveform:
Top Waveform - Modulation
Bottom Waveform - Output Voltage

LMC555 866915.png