SLVSH51B July   2023  – February 2025 TPS631012 , TPS631013

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Rating
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 
    6. 6.6 Timing Requirements
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Device Enable (EN)
      4. 7.3.4 Output Voltage Control
      5. 7.3.5 Mode Selection (PFM/FPWM)
      6. 7.3.6 Output Discharge
      7. 7.3.7 Reverse Current Operation
      8. 7.3.8 Protection Features
        1. 7.3.8.1 Input Overvoltage Protection
        2. 7.3.8.2 Output Overvoltage Protection
        3. 7.3.8.3 Short Circuit Protection/Hiccup
        4. 7.3.8.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
    6. 7.6 Register Map
      1. 7.6.1 Register Description
        1. 7.6.1.1 Register Map
        2. 7.6.1.2 Register CONTROL1 (Register address: 0x02; Default: 0x08)
        3. 7.6.1.3 Register VOUT (Register address: 0x03; Default: 0x5C)
        4. 7.6.1.4 Register CONTROL2 (Register address: 0x05; Default: 0x45)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Setting the Output Voltage
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information
Data Sheet

TPS631012 and TPS631013 1.6V to 5.5V Input Voltage 1.5A Buck-boost Converter with I2C in Wafer Chip Scale Package