Packaging information

Ball Grid Array (BGA)

TI Ball Grid Array (BGA) packages are offered in different configurations such as nfBGA, uBGA, FCBGA, PGA, and jrBGA. BGA devices support a plethora of applications including, but not limited to, wireless infrastructure, mobile, portable electronics, automotive, aerospace, and industrial applications. Known as a high-pin-density ball grid array solution in a miniature package, the BGA package is a popular packaging option for devices with high I/O requirements.

chip  725 total package options for the Texas Instruments Ball Grid Array (BGA).
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