Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package groups
BGA Ball Grid Array
CFP Both Formed and Unformed CFP = Ceramic Flat Pack
LGA Land Grid Array
PFM Plastic Flange Mount Package
QFP Quad Flat Package
SIP Single-In-Line Package
OPTO* Light Sensor Package = optical
RFID Radio Frequency Identification Device
CGA Column Grid Array
COF Chip on Flex
COG Chip on Glass
DIP Dual In-Line Package
DSBGA Die Size Ball Grid Array (WCSP = Wafer Chip Scale Package)
LCC Leaded Chip Carrier
NFMCA-LID Substrate Metal Cavity with Lid
PGA Pin Grid Array
POS Package on Substrate
QFN Quad Flatpack No Lead
SO Small Outline
SON Small Outline No Lead
TO Transistor Outlines
ZIP Zig-Zag In-Line
uCSP Micro Chip Scale Package
DLP Digital Light Processing
Module Module
TAB Tape Automated Bonding Package
Package family
CBGA Ceramic Ball Grid Array
CDIP Glass-Sealed Ceramic Dual In-Line Package
CDIP SB Side-Braze Ceramic Dual In-Line Package
CPGA Ceramic Pin Grid Array
CZIP Ceramic Zig-Zag Package
DFP Dual Flat Package
FC/CSP Flip Chip / Chip Scale Package
HLQFP Thermally Enhanced Low Profile QFP
HQFP Thermally Enhanced Quad Flat Package
HSOP Thermally Enhanced Small-Outline Package
HTQFP Thermally Enhanced Thin Quad Flat Pack
HTSSOP Thermally Enhanced Thin Shrink Small-Outline Package
HVQFP Thermally Enhanced Very Thin Quad Flat Package
JLCC J-Leaded Ceramic or Metal Chip Carrier
LCCC Leadless Ceramic Chip Carrier
LQFP Low Profile Quad Flat Pack
PDIP Plastic Dual-In-Line Package
SOJ J-Leaded Small-Outline Package
SOP Small-Outline Package (Japan)
SSOP Shrink Small-Outline Package
TQFP Thin Quad Flat Package
TSSOP Thin Shrink Small-Outline Package
TVFLGA Thin Very-Fine Land Grid Array
TVSOP Very Thin Small-Outline Package
VQFP Very Thin Quad Flat Package
DIMM* Dual-In-Line Memory Module
HSSOP* Thermally Enhanced Shrink Small-Outline Package
LPCC* Leadless Plastic Chip Carrier
MCM* Multi-Chip Module
MQFP* Metal Quad Flat Package
PLCC* Plastic Leaded Chip Carrier
PPGA* Plastic Pin Grid Array
SDIP* Shrink Dual-In-Line Package
SIMM* Single-In-Line Memory Module
SODIMM* Small Outline Dual-In-Line Memory Module
TSOP* Thin Small-Outline Package
VSOP* Very Small Outline Package
XCEPT* Exceptions - May not be a real Package
Product preference code
P Preferred package. Package is qualified and orderable.
OK Use if a preferred package is not available.
A Requires department/business unit approval.
N Not recommended for new designs.
X Do not use. No longer supported. Not qualified. No longer tooled.
Quality terms
JEDEC The JEDEC Standard for this package type.
Length The length of the device (in millimeters).
Maximum height The maximum height above board surface form (in millimeters).
Pkg Package designator code used in TI part numbers.
Pins The number of pins or terminals on the package.
Package type | Pins The TI package designator for a device, or the number of pins for a device.
Pitch The distance between the centers of adjacent pins (in millimeters).
Thickness The maximum thickness of the package body (in millimeters).
Type The abbreviated acronymn for this type of package.
Width The width of the device (in millimeters).
ePOD Enhanced Package Online (Typically includes package outline, land pattern, and stencil design).
Land pattern The pattern of solderable area on the PCB where a "no-lead" package may rest.
Footprint The periphery leads and thermal pad of a "no-lead" package.
Coplanarity The bottom surface of the package is parallel to the landing surface of the PCB.
Thermal pad = Exposed pad = Power pad The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements
Search part number The TI or customer part number entered on the initial Search page.
TI part number The part number to use when placing orders.
PN type Indicates whether the part number is Pb-Free or standard.
Eligibility The device can be added to the ESL list immediately.
Assembly site The plant location(s) where a TI device is assembled.
RoHS & High-Temp compatible (Y/N) Indicates whether or not a device meets TI's "Pb-free" definition.

TI defines "Lead-free (Pb-free)" or "Pb-free" to mean semiconductor products that are compatible with the current RoHS requirements for all six substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials.

Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

RoHS On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006.
Pb-free (RoHS) available supply date The forecasted or actual date that the device will be available for purchase.
Current Lead/Ball finish The current metal finish on the leads or solder balls of a device.
Planned Lead/Ball finish The planned metal finish on the leads or solder balls of a Pb-Free device.
Current MSL/reflow ratings The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL/reflow ratings are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.
Green compatible (Y/N) Indicates whether or not a device meets TI's "green" definition.
Green TI defines "green" to mean Pb-free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
RoHS restricted substances - ppm

The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance. 

Example: PPM= 1000000 X total amount of lead in component (mg)

Total leadframe plating weight (mg)

RoHS restricted substances - amount (mg) The total amount of each RoHS substance in the component
Green reportable substances - ppm

The ppm calculations are at the homogeneous material level and are worst-case ppm for each green substance. 

Example: ppm= 1000000 X total amount of antimony in component (mg)

total mold compound weight (mg)

Green reportable substances - amount (mg) The total amount of each green substance in the component.
Recyclable metals - ppm

The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. The ppm calculations are at the component level.

Example: ppm= 1000000 X total amount of gold in component (mg)

total component weight (mg)

Recyclable metals - amount (mg)  The total amount of each recyclable metal in the component.
Total device mass (mg)  Weight of the component in milligrams.
IEC 62474 Database
TI products that are compliant to RoHS requirements are also compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide).
IEC 62474 Database – Mandatory The mandatory substances contained within the IEC 62474 Database are restricted based on WW legislation. These substances shall be reported if thresholds defined within the database are exceeded.
IEC 62474 Database – Optional The optional substances contained within the IEC 62474 Database are reportable based on industry defined reporting requirements. These substances may be reported if thresholds defined within the database are exceeded.
Extended shelf life TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.
Mass (mg) Representative device weight (per part) in milligram
REACH status The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC). This list is usually updated 2 times per year.
IEC 62474 DB Is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time.