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Ceramic Flat Pack (CFP) is a rectangular package with leads on opposite sides of the package, and square package (Quad Flat Pack) with leads are on all four sides. Preformed leads with gull wing can be surface mounted onto the boards. Ceramic package that is hermetically sealed is intended for high reliability for space, radiation or military/defense applications. It is also suited for special commercial applications.

Ceramic Flat Pack (CFP)

chip  65 total package options for the Texas Instruments Ceramic Flat Pack (CFP).
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