Find TI packages

Chip on Flex (COF) packaging is a direct placement of die on to a flexible substrate. Customer integration methods can include using ACF bonding or ZIF (Zero Insertion Force) connectors. Applications are well suited for high pin-count and fine pitch. TI offers medical analog front-end (AFE) devices and digital X-ray flat-panel detectors (FPD) that use this package type.

Chip on Flex (COF)

chip 4 total package options for the Texas Instruments Chip on Flex (COF).
Use the filter panel to further refine your search.

Package family

TI package name

Pin count

Pitch (mm)

Maximum height (mm)

Length (mm)

Width (mm)