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Chip on Flex (COF) packaging is a direct placement of die on to a flexible substrate. Customer integration methods can include using ACF bonding or ZIF (Zero Insertion Force) connectors. Applications are well suited for high pin-count and fine pitch. TI offers medical analog front-end (AFE) devices and digital X-ray flat-panel detectors (FPD) that use this package type.
Chip on Flex (COF)
2 total package options for the Texas Instruments Chip on Flex (COF).
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