Packaging information

Small Outline (SO)

Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). High utilization across many industries and high reliablity makes this a standard package well-suited for numerous applications, including automotive and industrial. Packages are available with or without an exposed pad, depending on thermal and electrical requirements.

chip  180 total package options for the Texas Instruments Small Outline (SO).
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