Packaging information

Small Outline No Lead (SON)

Small Outline No Lead (SON) packages provide a small form factor at 0.4 and 0.5mm pitch. These are normally smaller pincount devices in a robust, plastic package compatible with all end equipment including automotive. Quad lead version is referred to as QFN.

chip  133 total package options for the Texas Instruments Small Outline No Lead (SON).
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