Packaging information

Micro ChipScale Package (uCSP)

Microstar Chip Scale Packages (µCSP) are rectangular in shape with solder ball connections on the bottom side of the package. The grid arrangement of the µCSP package allows high pin count and a popular package for a wide range of applications. It is not recommended for new designs at this time.

chip  10 total package options for the Texas Instruments Micro ChipScale Package (uCSP).
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