CC256X-REPORTS — Reports: CC256x Regulatory Certification Reports
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TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module
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The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
For additional terms or required resources, click any title below to view the detail page where available.
TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module
The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)
The Bluetooth and MSP430 Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference design is a cost-effective (...)
The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.
For a complete evaluation solution, (...)
The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.
For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)
The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.
For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and (...)
The DLP NIRscan Nano is a compact battery-operated evaluation module (EVM) for portable near-infrared spectroscopy solutions. Featuring the DLP2010NIR digital micromirror device (DMD), the NIRscan Nano supports Bluetooth low energy to enable mobile lab measurements for hand-held spectrometers. The (...)
Special Note:
The MSP430F5529 USB microcontroller development kit is not supported by the Mac or Linux versions of the Code Composer Studio™ Integrated Development Environment. If you want to work with these operating systems, we suggest you select one of the many MSP LaunchPads.
The MSP430F5529 (...)
TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)
TMP107 temperature sensor daisy-chain BoosterPack™ plug-in module
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Link to FCC, ISED, & Certification Reports
Link to FCC, ISED, & Certification Reports
Link to CC2564MODNEM Reference Only Certification Reports
Link to CC2564MODAEM Reference Only Certification Reports
Link to CC256xQFNEM Reference Only Certification Reports
Link to CC256xCQFN-EM Reference Only Certification Reports
Link to BOOST-CC2564MODA Reference Only Certification Reports