Bluetooth® 4.1 with Basic Rate (BR), Enhanced Data Rate (EDR), Low Energy (LE) module
Product details
Parameters
Features
- Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
- CC2564MODA With Integrated Antenna
- CC2564MODN With External Antenna
- Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
- FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
- CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
- Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
- Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
- CC2564MODA
- Integrated Chip Antenna
- Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
- CC2564MODN
- Single-Ended 50-Ω RF Interface
- Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
- CC2564MODA
- BR and EDR Features Include:
- Up to Seven Active Devices
- Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
- Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
- Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
- Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
- Support of Multiple Bluetooth Profiles With Enhanced QoS
- Low Energy Features Include:
- Support of up to 10 Simultaneous Connections
- Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
- Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
- Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
- Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
- Class 1.5 TX Power up to +10 dBm
- –93 dbm Typical RX Sensitivity
- Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
- Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
- Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
- Advanced Power Management for Extended Battery Life and Ease of Design
- On-Chip Power Management, Including Direct Connection to Battery
- Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
- Shutdown and Sleep Modes to Minimize Power Consumption
- Physical Interfaces:
- UART Interface With Support for Maximum Bluetooth Data Rates
- UART Transport Layer (H4) With Maximum Rate of 4 Mbps
- Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
- Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
- UART Interface With Support for Maximum Bluetooth Data Rates
- CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack
All trademarks are the property of their respective owners. All trademarks are the property of their respective owners.
Description
The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.
Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:
- Serial port profile (SPP)
- Advanced audio distribution profile (A2DP)
- Audio/video remote control profile (AVRCP)
- Hands-free profile (HFP)
- Human interface device (HID)
- Generic attribute profile (GATT)
- Several Bluetooth low energy profiles and services
For more information, see TI Dual-Mode Bluetooth Stack.
In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA). The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)
Features
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Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1
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Integrated antenna on CC2564MODA for ready to use application
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FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface
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Class 1.5 Transmit Power (...)
Description
The Bluetooth and MSP430 Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference design is a cost-effective (...)
Features
- Enables Bluetooth audio (SBC encode/decode) with low cost, low power MSP430F5229
- Design offloads audio processing from MCU to the Bluetooth device which enables low power audio
- Cost-effective low end wireless audio solution with a four layer layout and QFN packages
- Core of the solution is TI's (...)
Description
The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.
For a complete evaluation solution (...)
Features
- Dual-mode (Bluetooth & Bluetooth low energy ) Bluetooth Specification v4.1
- Integrated antenna on CC2564MODA for ready-to-use application
- The device is FCC, IC, CE certified with a certified and royalty-free TI Bluetooth Stack, getting started guide, demos, and UART and PCM/I2S Interface
- Class 1.5 (...)
Description
The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.
For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)
Features
- CC2564MODN device in the QFM (MOE) package
- Bluetooth Specification v4.1
- Dual mode: Bluetooth and Bluetooth Low Energy
- FCC, IC, CE certified
- Class 1.5 Transmit Power (10 dBm)
- High sensitivity (-93 dBm typical)
- UART interface: control and data
- PCM/I2S interface: voice and audio
- 4-layer PCB design
- 1.8-V LDO (...)
Description
The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.
For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and (...)
Features
- CC2564B device (QFN package)
- Bluetooth Specification v4.1
- Dual Mode - Bluetooth & Bluetooth low energy
- FCC, IC, CE certified
- Class 1.5 Transmit Power (+12dBm)
- High sensitivity (-93 dBm typ.)
- UART Interface - Control and Data
- PCM/I2S Interface - Voice and Audio
- 4 Layer PCB design
- 1.8 LDO (LP2985-18)
- 3 Voltage (...)
Description
The DLP NIRscan Nano is a compact battery-operated evaluation module (EVM) for portable near-infrared spectroscopy solutions. Featuring the DLP2010NIR digital micromirror device (DMD), the NIRscan Nano supports Bluetooth low energy to enable mobile lab measurements for hand-held spectrometers. The (...)
Features
- Key Features
- Mobile Sensing EVM: DLP NIRscan Nano
- High Performance EVM: DLP NIRscan
- Evaluation Module (EVM) Usage
- Mobile Sensing EVM: Battery
- High Performance EVM: Benchtop/Portable
- Featured Digital Micromirror Device
- Mobile Sensing EVM: DLP2010NIR
- High Performance EVM: DLP4500NIR
- Micromirror Array Size (pixels)
- (...)
Description
The MSP430F5438 Experimenter Board (MSP-EXP430F5438) is a microcontroller development for highly integrated, high performance MSP430F5438 MCUs. It features a 100-pin socket which supports the MSP430F5438A and other devices with similar pinout. The socket allows for quick upgrades (...)
Features
- 100-pin socket for MSP430F5438A MCU:
- Digital I/O Pins: 34
- Accessible analog inputs (12-bit ADC): 5
- PWM outputs: 12
- Flash Memory (MSP430F5438): 256KB
- RAM (MSP430F5438): 16KB
- Clock Speed (MSP430F5438): 18MHz
- Communication (MSP430F5438)
- 4x UART/LIN/IrDA/SPI
- 4x I2C/SPI
- Power Supply sources: USB, FET, 2x AA (...)
Description
Special Note:
The MSP430F5529 USB microcontroller development kit is not supported by the Mac or Linux versions of the Code Composer Studio™ Integrated Development Environment. If you want to work with these operating systems, we suggest you select one of the many MSP LaunchPads.
The MSP430F5529 (...)
Features
- Integrated MSP430F5529:
- 128KB Flash / 8KB SRAM (10kB if USB is disabled)
- Full-Speed USB 2.0
- 16-Bit RISC Architecture up to 25-MHz
- 3x Timer_A Blocks, 1x Timer_B Block
- 2x USCI (UART/SPI/I2C) Blocks, 16Ch 12-Bit ADC12_A, 12Ch Comp_B, 63 I/Os
- USB Development Platform
- 5-pad capacitive touch strip (button or (...)
Description
The TM4C129x Connected Development Kit is a versatile and feature-rich engineering platform that highlights the 120-MHz TM4C129XNCZAD IoT Enabled ARM Cortex-M4F based microcontroller, including an integrated 10/100 Ethernet MAC + PHY as well as many other key features.
Features
The IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit offers these features:
- Color LCD interface
- USB 2.0 OTG | Host | Device port
- TI wireless EM connection
- BoosterPack™ and BoosterPack XL interfaces
- Quad SSI-supported 512-Mbit Flash memory
- MicroSD slot
- Expansion interface headers: MCU (...)
Description
TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)
Features
- Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royalty free
- The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
- Fully Thread safe
- Supports threaded (RTOS) and non-threaded (No OS) environment
- Fully Documented API Interface
- Works with any STM32F4 MCU
- Sample Apps are available for (...)
Software development
TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free (...)
Features
- Supports Dual-mode Bluetooth 4.0/4.10 - Bluetooth certified and royalty free
- 4.2 Low Energy Secure Connect supported
- Fully SIG qualified
- Protocols/Profiles can be selectively enabled/disabled
- Fully Documented API Interface
- Classic Profiles Available (varies between the different platforms, see specific (...)
Features
- Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
- The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849)
- Fully Thread safe
- Supports threaded (RTOS) and non-threaded (No OS) environment
- Fully Documented API Interface
- Works with any TM4C MCU with Flash >= 128KB
- Sample Apps (...)
Features
Features
- Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
- The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849)
- Fully Thread safe
- Supports non-threaded (No OS) environment
- Fully Documented API Interface
- Works with any MSP430 MCU with Flash >= 128KB and RAM >= 8KB
- Sample Apps are (...)
Design tools & simulation
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
- Step 2 (...)
Features
- The CC256X-REPORTS link provides access to Dual mode BTcertification reports for:
- CC256x modules
- CC256x Evaluation boards (note: reports for evaluation boards are for reference only)
- The CC256X-REQUEST link provides:
- A TI letter of authorization for FCC and ISED when requested by the customer's regulatory (...)
Reference designs
Design files
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download TIDA-00554 PCB.zip (1404KB) -
download TIDA-00554 Gerber (Rev. A).zip (2338KB) -
download TIDA-00554 CAD Files (Board Layout) (Rev. A).zip (1912KB) -
download TIDA-00554 BOM (Rev. A).zip (124KB) -
download TIDA-00554 CAD Files (Opto Mechanical) (Rev. A).zip (4435KB) -
download TIDA-00554 CAD Files (Board Schematics) (Rev. C).zip (1305KB) -
download TIDA-00554 Fiber Input Illumination Module.zip (225KB) -
download TIDA-00554 Assembly Files (Rev. A).zip (3798KB) -
download TIDA-00554 Detector Board (VR=1V) Reference Design ESD.zip (309KB) -
download TIDA-00554 Assembly Files (Four Lamp Illumination Module).zip (472KB) -
download TIDA-00554 Stand-off Head Design CAD Files (Solidworks).zip (4719KB) -
download TIDA-00554 Detector Board (Vr=1V) Reference Design BOM (Rev. A).pdf (93KB) -
download TIDA-00554 BOM (NIRscan Nano Board) (Rev. B).zip (120KB)
Design files
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download Bluetooth Dual Mode Audio Source Reference Design Bill of Materials (BOM).zip (25KB) -
download Bluetooth Dual Mode Audio Source Reference Design Gerber Design Files.zip (281KB) -
download Bluetooth Dual Mode Audio Source Reference Design Layer Plots Design Files.pdf (1300KB) -
download Bluetooth Dual Mode Audio Source Reference Design Assembly Drawings Design Files.pdf (537KB) -
download Bluetooth Dual Mode Audio Source Reference Design CAD Design Files.zip (646KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| (MOE) | 33 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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