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ESD122

ACTIVE

Dual 0.2-pF, ±3.6-V, ±17-kV ESD protection diode for USB Type-C and HDMI 2.0

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Data sheet

ESD122

ACTIVE
Data sheet Order now

Product details

Package name DFN1006 Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 IEC 61000-4-2 contact (±V) 17000 IEC 61000-4-5 (A) 2.5 Clamping voltage (V) 13.5 Dynamic resistance (typ) 0.5 Interface type HDMI 1.4, HDMI 2.0, SATA/PCIe, USB 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
Package name DFN1006 Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 IEC 61000-4-2 contact (±V) 17000 IEC 61000-4-5 (A) 2.5 Clamping voltage (V) 13.5 Dynamic resistance (typ) 0.5 Interface type HDMI 1.4, HDMI 2.0, SATA/PCIe, USB 2.0, USB 3.0, USB Type-C Breakdown voltage (min) (V) 5 IO leakage current (max) (nA) 10 Rating Catalog Operating temperature range (°C) -40 to 125
X2SON (DMX) 3 0.6 mm² 1 x 0.6 X2SON (DMY) 3 0.78 mm² 1.3 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

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Technical documentation

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Type Title Date
* Data sheet ESD122 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) PDF | HTML 13 Aug 2018
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Application brief ESD Protection for HDMI Applications (Rev. A) PDF | HTML 01 Nov 2023
Application note Capacitance Requirements for High Speed Signals (Rev. A) PDF | HTML 21 Aug 2023
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 Sep 2021
Technical article ESD fundamentals, part 4: ESD capacitance PDF | HTML 12 Feb 2018
Technical article ESD fundamentals, part 3: clamping voltage PDF | HTML 06 Dec 2017
Application note ESD224 HDMI 2.0 Compliance and Protection 30 Nov 2017
Technical article Big USB Type-C™ protection for your small application PDF | HTML 31 Jul 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — ESD evaluation module

The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested. For typical (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

ESD122 IBIS Model

SLVMC36.ZIP (2 KB) - IBIS Model
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Reference designs

TIDA-01620 — USB Type-C® to DisplayPort active cable reference design

The USB Type-C® to DisplayPort Active Cable reference design is a framework that can enable DisplayPort video signaling over a USB Type-C connection. Traditionally, DisplayPort connectors transfer DisplayPort video but this connector can be large and are not ideal for small electronics. While a (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01588 — 10.8-V/15-W, >90% Efficiency, 2.4-cm2, Power Stage Reference Design for Brushed DC Servo Drive

This 15W, 12-mm x 20-mm, power stage reference design drives and controls the position of the brushed DC (BDC) motor operating from a three to six cell Li-ion battery. This highly efficient solution is optimized with a very small form factor that easily fits into the motor, and supports precise (...)
Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
X2SON (DMX) 3 Ultra Librarian
X2SON (DMY) 3 Ultra Librarian
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