Product details

Number of channels (#) 2 IO capacitance (Typ) (pF) 0.2 Vrwm (V) 3.6 IEC 61000-4-2 contact (+/- kV) 18 IEC 61000-4-5 (A) 2.5 Bi-/uni-directional Bi-Directional Dynamic resistance (Typ) (Ω) 0.5 Clamping voltage (V) 13.5 IO leakage current (Max) (nA) 10 Rating Catalog Operating temperature range (C) -40 to 125
Number of channels (#) 2 IO capacitance (Typ) (pF) 0.2 Vrwm (V) 3.6 IEC 61000-4-2 contact (+/- kV) 18 IEC 61000-4-5 (A) 2.5 Bi-/uni-directional Bi-Directional Dynamic resistance (Typ) (Ω) 0.5 Clamping voltage (V) 13.5 IO leakage current (Max) (nA) 10 Rating Catalog Operating temperature range (C) -40 to 125
X2SON (DMX) 3 1 mm² 1 x .6 X2SON (DMY) 3 1 mm² 1.3 x .6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

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Technical documentation

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Type Title Date
* Data sheet ESD122 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) PDF | HTML 13 Aug 2018
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
Application note ESD and Surge Protection for USB Interfaces (Rev. A) PDF | HTML 17 Aug 2022
Technical article ESD fundamentals, part 4: ESD capacitance 12 Feb 2018
Technical article ESD fundamentals, part 3: clamping voltage 06 Dec 2017
Technical article Big USB Type-C™ protection for your small application 31 Jul 2017

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESD122DMX-EVM — ESD122DMX USB Type-C Interface Evaluation Module

Texas Instrument’s ESD122DMX evaluation module (EVM) helps designers evaluate the operation and performance of the ESD122 device. The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. This device is rated to dissipate contact ESD strikes (...)
User guide: PDF
Not available on TI.com
Evaluation board

ESD122DMY-EVM — ESD122DMY USB Type-C Interfaces Evaluation Module

Texas Instrument’s ESD122DMY evaluation module helps designers evaluate the operation and performance of the ESD122 device. The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. This device is rated to dissipate contact ESD strikes at the (...)
User guide: PDF
Not available on TI.com
Simulation model

ESD122 IBIS Model

SLVMC36.ZIP (2 KB) - IBIS Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Reference designs

TIDA-01620 — USB-C™ to DisplayPort Active Cable Reference Design

The USB-C™ to DisplayPort Active Cable reference design is a framework that can enable DisplayPort video signaling over a USB-C connection. Traditionally, DisplayPort connectors are the only way to transfer DisplayPort video but this connector can be large and are not ideal for small (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-01588 — 10.8-V/15-W, >90% Efficiency, 2.4-cm2, Power Stage Reference Design for Brushed DC Servo Drive

This 15W, 12-mm x 20-mm, power stage reference design drives and controls the position of the brushed DC (BDC) motor operating from a three to six cell Li-ion battery. This highly efficient solution is optimized with a very small form factor that easily fits into the motor, and supports precise (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
X2SON (DMX) 3 View options
X2SON (DMY) 3 View options

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