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Product details

Parameters

Number of channels (#) 4 IO capacitance (Typ) (pF) 4.5 Vrwm (V) 3.6 IEC 61000-4-2 contact (+/- kV) 30 IEC 61000-4-5 (A) 12 Features Surge Protection Bi-/uni-directional Uni-Directional IO leakage current (Max) (nA) 50 Rating Catalog Operating temperature range (C) -40 to 125 Clamping voltage (V) 5.5 open-in-new Find other ESD protection & TVS surge diodes

Package | Pins | Size

SOT-23 (DBV) 5 5 mm² 2.9 x 1.6 open-in-new Find other ESD protection & TVS surge diodes

Features

  • IEC 61000-4-2 Level 4 ESD Protection
    • ±30-kV Contact Discharge
    • ±30-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 12 A (8/20 µs)
    • Low Surge Clamping Voltage 6 V at 12 A Ipp
  • IO Capacitance:
    • 2.3 pF (Typical)
  • DC Breakdown Voltage: 4.5 V (Minimum)
  • Ultra Low Leakage Current: 3 nA (Typical)
  • Supports High Speed Interfaces up to 1 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Easy Flow-Through Routing Package (ESDS302)

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Description

The ESDS302, ESDS304 devices are bidirectional TVS ESD protection diode array in two and four channel configurations respectively, for Ethernet and USB surge protection up to 12 A (8/20 µs). The ESDS302, ESDS304 devices are rated to dissipate ESD strikes up to 30 kV per the IEC 61000-4-2 international standard (> Level 4).

The devices features a 2.3-pF IO capacitance per channel making it ideal for protecting high-speed interfaces such as Ethernet 1G and USB 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The ESDS302, ESDS304 devices are offered in the industry standard 5-Pin SOT23 packages.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet ESDS302, ESDS304 Data-Line Surge and ESD Protection Devices datasheet (Rev. A) Sep. 21, 2018
Application note ESD Packaging and Layout Guide Aug. 27, 2020
White paper Demystifying surge protection Nov. 06, 2018
Application note Protecting ethernet ports from surge events Oct. 10, 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For the (...)
Features
  • Allows testing of most TI ESD devices
  • Many footprints to allow testing of each part
  • S-parameter testing for signal integrity

Design tools & simulation

SIMULATION MODEL Download
SLVMCS9.ZIP (37 KB) - S-Parameter Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)
SIMULATION TOOL Download
SPICE-based analog simulation program
TINA-TI TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)

CAD/CAE symbols

Package Pins Download
SOT-23 (DBV) 5 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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