Product details

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 22 CON (typ) (pF) 23.4 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 35 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (A) 0.025 Rating Catalog Drain supply voltage (max) (V) 5.5
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 22 CON (typ) (pF) 23.4 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 35 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (A) 0.025 Rating Catalog Drain supply voltage (max) (V) 5.5
SOP (NS) 16 79.56 mm² (10.2 mm × 7.8 mm) SOIC (D) 16 59.4 mm² (9.9 mm × 6 mm) TSSOP (PW) 16 32 mm² (5 mm × 6.4 mm) SSOP (DB) 16 48.36 mm² (6.2 mm × 7.8 mm) SOT-23-THN (DYY) 16 8.4 mm² (4.2 mm × 2 mm) VQFN (RGY) 16 14 mm² (4 mm × 3.5 mm) TVSOP (DGV) 16 23.04 mm² (3.6 mm × 6.4 mm) PDIP (N) 16 181.42 mm² (19.3 mm × 9.4 mm)
  • 1.65V to 5.5V VCC operation
  • Support mixed-mode voltage operation on all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model (A114-A)
    • 200V machine model (A115-A)
    • 1000V charged-device model (C101)
  • 1.65V to 5.5V VCC operation
  • Support mixed-mode voltage operation on all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 100mA per JESD 78, class II
  • ESD protection exceeds JESD 22
    • 2000V human-body model (A114-A)
    • 200V machine model (A115-A)
    • 1000V charged-device model (C101)

The SN74LV4051A 8-channel CMOS analog multiplexers and demultiplexers are designed for 1.65V to 5.5V VCC operation.

The SN74LV4051A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include: signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

The SN74LV4051A 8-channel CMOS analog multiplexers and demultiplexers are designed for 1.65V to 5.5V VCC operation.

The SN74LV4051A devices handle both analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include: signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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* Data sheet SN74LV4051A 8-Channel Analog Multiplexers and Demultiplexers datasheet (Rev. K) PDF | HTML Sep 11, 2024
Product overview Enhancing Smart Metering with TI Multiplexers and Analog Switches PDF | HTML Jan 28, 2025
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021

Design & development

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Evaluation board

16DYYPWEVM — Test board for SOT-23 THIN (DYY) and TSSOP (PW) packages

The 16DYYPWEVM test board provides a dual footprint for SOT-23 THIN (DYY) and TSSOP (PW) packages.  This test board is used for quick prototyping and testing of integrated ciructs in 16 pin SOT-23 THIN (DYY) and TSSOP (PW) packages. 
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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Simulation model

SN74LV4051A PSpice Transient Model

SCLM117.ZIP (35 KB) - PSpice model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
SOP (NS) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
SSOP (DB) 16 Ultra Librarian
SOT-23-THN (DYY) 16 Ultra Librarian
VQFN (RGY) 16 Ultra Librarian
TVSOP (DGV) 16 Ultra Librarian
PDIP (N) 16 Ultra Librarian

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