Product details

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 200 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 35 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 330 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) 44
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 2 CON (typ) (pF) 200 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 35 Bandwidth (MHz) 30 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 330 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) 44
TSSOP (PW) 16 32 mm² 5 x 6.4 WQFN (RUM) 16 16 mm² 4 x 4
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2 Ω
  • High current support: 330 mA (maximum) (WQFN)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2 Ω
  • High current support: 330 mA (maximum) (WQFN)
  • –40°C to +125°C operating temperature
  • 1.8 V logic compatible
  • Integrated pull-down resistor on logic pins
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional operation

The TMUX7236 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a dual channel, 2:1 configuration. The device works well with dual supplies (±5 V to ±22 V), a single supply (5 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The TMUX7236 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from V SS to V DD.

All logic control inputs support logic levels from 1.8 V to V DD, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

The TMUX7236 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a dual channel, 2:1 configuration. The device works well with dual supplies (±5 V to ±22 V), a single supply (5 V to 44 V), or asymmetric supplies (such as V DD = 12 V, V SS = –5 V). The TMUX7236 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from V SS to V DD.

All logic control inputs support logic levels from 1.8 V to V DD, allowing for both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

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Technical documentation

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Type Title Date
* Data sheet TMUX7236 44 V, Low-RON, 2:1 (SPDT), 2-Channel Precision Switch With Latch-Up Immunity and 1.8 V Logic datasheet (Rev. B) PDF | HTML 01 Dec 2023
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TMUX-24PW-EVM — TMUX generic evaluation module for 16-, 20- and 24-pin PW thin shrink small-outline packages (TSSOP)

The TMUX-24PW-EVM evaluation module allows for the quick prototyping and DC characterization of the TI line of TMUX products that use 16-, 20- or 24-pin TSSOP packages (PW) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TMUXRUM-RRPEVM — TMUX generic evaluation module for 16-pin RUM and RRP quad-flatpack no-lead (QFN) packages

The TMUXRUM-RRPEVM allows for the quick prototyping and DC characterization of  the TI line of TMUX products that use 16-pin RUM or RRP packages (QFN) and is rated for high-voltage operation.

User guide: PDF | HTML
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX7236 IBIS Model

SCDM295.ZIP (52 KB) - IBIS Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 16 Ultra Librarian
WQFN (RUM) 16 Ultra Librarian

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