Product details

Number of channels (#) 1 IO capacitance (Typ) (pF) 0.18 Vrwm (V) 3.6 IEC 61000-4-2 contact (+/- kV) 15 IEC 61000-4-5 (A) 2.5 Features Bi-/uni-directional Bi-Directional IO leakage current (Max) (nA) 10 Rating Catalog Operating temperature range (C) -40 to 125 Dynamic resistance (Typ) (Ω) 0.57 Clamping voltage (V) 7
Number of channels (#) 1 IO capacitance (Typ) (pF) 0.18 Vrwm (V) 3.6 IEC 61000-4-2 contact (+/- kV) 15 IEC 61000-4-5 (A) 2.5 Features Bi-/uni-directional Bi-Directional IO leakage current (Max) (nA) 10 Rating Catalog Operating temperature range (C) -40 to 125 Dynamic resistance (Typ) (Ω) 0.57 Clamping voltage (V) 7
X1SON (DPY) 2 1 mm² .6 x 1 X2SON (DPL) 2 0 mm² .6 x .3
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±15-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • IO Capacitance:
    • 0.18 to 0.20 pF (Typical)
    • 0.20 to 0.23 pF (Maximum)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Ultra Low Leakage Current: 10-nA (Maximum)
  • Low ESD Clamping Voltage: 15 V at 16 A TLP
  • Low Insertion Loss: 26.9 GHz (–3 dB Bandwidth, DPL)
  • Supports High Speed Interfaces up to 20 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0201 and 0402 footprints
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±15-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • IO Capacitance:
    • 0.18 to 0.20 pF (Typical)
    • 0.20 to 0.23 pF (Maximum)
  • DC Breakdown Voltage: 6.4 V (Typical)
  • Ultra Low Leakage Current: 10-nA (Maximum)
  • Low ESD Clamping Voltage: 15 V at 16 A TLP
  • Low Insertion Loss: 26.9 GHz (–3 dB Bandwidth, DPL)
  • Supports High Speed Interfaces up to 20 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Industry Standard 0201 and 0402 footprints

The TPD1E01B04 is a bidirectional TVS ESD protection diode array for USB Type-C and Thunderbolt 3 circuit protection. The TPD1E01B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.18 to 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and Thunderbolt 3. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04 is offered in the industry standard 0201 (DPL) package and 0402 (DPY) packages.

The TPD1E01B04 is a bidirectional TVS ESD protection diode array for USB Type-C and Thunderbolt 3 circuit protection. The TPD1E01B04 is rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.18 to 0.20-pF (typical) IO capacitance making it ideal for protecting high-speed interfaces up to 20 Gbps such as USB 3.1 Gen2 and Thunderbolt 3. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD1E01B04 is offered in the industry standard 0201 (DPL) package and 0402 (DPY) packages.

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Technical documentation

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Type Title Date
* Data sheet TPD1E01B04 1-Channel ESD Protection Diode for USB Type-C and Thunderbolt 3 datasheet (Rev. C) 19 Dec 2016
User guide Generic ESD Evaluation Module User's Guide (Rev. A) 27 Sep 2021
Application note ESD Packaging and Layout Guide 27 Aug 2020
Technical article ESD fundamentals, part 4: ESD capacitance 12 Feb 2018
Technical article USB Type-C™: Will your ESD solution protect the port? 21 Nov 2016
Technical article The dangers of deep snap-back ESD circuit-protection diodes 12 Sep 2016
User guide TPD1E01B04DPY Evaluation Module User's Guide 08 Jul 2016
Application note Picking ESD Diodes for Ultra High-Speed Data Lines 29 Jun 2016
User guide TPD1E01B04 Evaluation Module User's Guide 26 Apr 2015

Design & development

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Evaluation board

ESDEVM — Generic ESD Evaluation Module

Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For the (...)
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Simulation model

TPD1E01B04 IBIS Model

SLVMBL8.ZIP (3 KB) - IBIS Model
Simulation model

TPD1E01B04 S-Parameter Model

SLVMBO2.ZIP (15 KB) - S-Parameter Model
Simulation model

TPD1E01B04 (DPL package) PSpice Transient Model

SLVMDK6.ZIP (85 KB) - PSpice Model
Simulation model

TPD1E01B04 (DPY package) PSpice Transient Model

SLVMDK7.ZIP (86 KB) - PSpice Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Package Pins Download
X1SON (DPY) 2 View options
X2SON (DPL) 2 View options

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