This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
| Part number | Order | Number of channels (#) | IO capacitance (Typ) (pF) | Vrwm (V) | IEC 61000-4-2 contact (+/- kV) | IEC 61000-4-5 (A) | Interface | Features | Bi-/uni-directional | IO leakage current (Max) (nA) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Dynamic resistance (Typ) (Ω) | Clamping voltage (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TPD2E007 |
|
2 | 15 | 13 | 8 | 4.5 | Audio | Bi-Directional | 50 | Catalog | -40 to 85 |
DSLGA | 4
SC70 | 3 |
4DSLGA: 1 mm2: .77 x .77 (DSLGA | 4)
3SC70: 3 mm2: 1.25 x 2 (SC70 | 3) |
3.5 | 14 |
