Dual 15-pF, ±13-V, ±8-kV ESD protection diode for AC Signal Data Interfaces
Product details
Parameters
Package | Pins | Size
Features
- IEC 61000-4-2 Level 4 ESD Protection
- ±8-kV IEC 61000-4-2 Contact Discharge
- ±15-kV IEC 61000-4-2 Air-Gap Discharge
- IEC 61000-4-5 Surge Protection
- 4.5-A Peak Pulse Current (8/20-µs Pulse)
- IO Capacitance 15 pF (Max)
- Low 50-nA Leakage Current
- Space-Saving PicoStar™ and SOT Package
Description
This device is a transient voltage suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level 4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in surface mount applications. The industry standard SOT package offers straightforward board layout option in legacy designs.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TPD2E007 2-Channel ESD Protection Array for AC-Coupled/Negative-Rail Data Interfaces datasheet (Rev. I) | Mar. 22, 2016 |
| Application note | ESD Packaging and Layout Guide | Aug. 27, 2020 | |
| User guide | Generic ESD Evaluation Module User's Guide | Apr. 03, 2018 | |
| Selection guide | System-Level ESD Protection Guide (Rev. C) | Feb. 20, 2018 | |
| Selection guide | ESD by Interface Selection Guide (Rev. A) | Jun. 26, 2017 | |
| White paper | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
| Application note | ESD Layout Guide | Mar. 04, 2015 | |
| Application note | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
| Application note | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Description
The DM38x Digital Video Evaluation Module (DVEVM) enables developers to start immediate evaluation of the DM38x Digital Media Processors and begin building digital video applications such as IP security cameras, action cameras, drones, video doorbells, car digital video recorders and other digital (...)
Features
- DM388 digital media processor-based development board with 2Gb DDR3
- Video capture and output of NTSC or PAL signals via component I/O
- HDMI video output
- CSI2 and parallel camera input
- PCIe, SATA 2x, ethernet 2x, USB x2, audio, SD-card slot
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| DSLGA (YFM) | 4 | View options |
| SC70 (DCK) | 3 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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