Dual 1.5-pF, 5.5-V, ±25-kV ESD protection diode with 5.5-A 8/20-uS surge rating for USB 2.0
Product details
Parameters
Package | Pins | Size
Features
- IEC 61000-4-2 Level 4
- ±25 kV (Contact discharge)
- ±30 kV (Air-gap discharge)
- IEC 61000-4-5 Surge protection
- 5.5-A Peak pulse current (8/20 µs Pulse)
- IO Capacitance 1.5 pF (Typ)
- DC Breakdown voltage 6.5 V (Min)
- Ultra-Low leakage current 10 nA (Max)
- Low ESD clamping voltage
- Industrial temperature range: –40°C to +125°C
- Small easy-to-route DRL and DCK package
All trademarks are the property of their respective owners.
Description
The TPD2E2U06 is a dual-channel low capacitance TVS diode ESD protection device. The device offers ±25-kV contact and ±30-kV air-gap ESD protection in accordance with the IEC 61000-4-2 standard. The 1.5-pF line capacitance of the TPD2E2U06 makes the device suitable for a wide range of applications. Typical application interfaces are USB 2.0, LVDS, and I2C™.
Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TPD2E2U06 Dual-Channel High-Speed ESD Protection Device datasheet (Rev. C) | Dec. 03, 2019 |
| Application note | ESD Packaging and Layout Guide | Aug. 27, 2020 | |
| User guide | Generic ESD Evaluation Module User's Guide | Apr. 03, 2018 | |
| Selection guide | ESD by Interface Selection Guide (Rev. A) | Jun. 26, 2017 | |
| White paper | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
| Technical articles | How to protect USB host ports with ESD current-limit protection devices | Mar. 25, 2015 | |
| Application note | ESD Layout Guide | Mar. 04, 2015 | |
| Technical articles | New reference designs available based on the new MSP430FR4133 MCU | Oct. 16, 2014 | |
| Application note | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
| Application note | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For the (...)
Features
- Allows testing of most TI ESD devices
- Many footprints to allow testing of each part
- S-parameter testing for signal integrity
Description
MMWAVEPOEEVM enables Power over Ethernet (PoE) for the TI mmWave sensors carrier card platform (MMWAVEICBOOST and compatible HW moduels sold separately). MMWAVEPOEEVM simplifies deployment for development, test, and production by providing power and data transmission over a single ethernet cable (...)
Features
- Fully compatible with 60-GHz to 64-GHz mmWave sensors carrier card platform (MMWAVEICBOOST)
- Compatible with mmWave evalution modules with LaunchPad connectivity
- Integrated RJ45, transformer, and diode bridge for PoE power stage for cost-effective BOM
- 7-W isolated output from flyback converter with (...)
Design tools & simulation
SLLM214A.ZIP (3 KB) - IBIS Model
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
TINA-TI — TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Reference designs
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| SC70 (DCK) | 3 | View options |
| SOT-5X3 (DRL) | 5 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.