5-channel Space-Sa-Ving ESD protection device
Product details
Parameters
Package | Pins | Size
Features
- Provides System-Level ESD Protection for Low-
Voltage I/O Interface - IEC 61000-4-2 Level 4
- ±15 kV (Contact Discharge)
- ±15 kV (Air-Gap Discharge)
- Typical I/O Capacitance 7 pF (VIO = 2.5 V)
- DC Breakdown Voltage: 6 V (Minimum)
- Low Leakage Current: 100 nA (Maximum)
- Low ESD Clamping Voltage
- Industrial Temperature Range: –40°C to 125°C
- IEC 61000-4-5 (Surge): 40 W (8/20-µs Pulse)
- Small, Easy-to-Route DPF Package
Description
The TPD5E003 is a five-channel electrostatic discharge (ESD) transient voltage
suppression (TVS) device. This device offers ±15-kV IEC contact and ±15-kV air-gap (level 4) ESD
protection, and features five identical ESD clamping diodes that can be used to protect either five
unidirectional (0 V to 5 V) I/O lines or four bidirectional (–5 V to 5 V) I/O lines. The compact
DPF package is an industry standard and is convenient for component placement in
space-constrained applications. Typical application interfaces include SIM card interfaces,
audio lines (mics, earphones, and speakerphones), SD interfaces, and keypads, or other buttons.
Typical end equipment includes cell phones, tablets, remote controllers, and wearables.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TPD5E003 Five-Channel Space-Saving ESD Protection Device datasheet (Rev. B) | Sep. 29, 2015 |
White paper | Designing USB for short-to-battery tolerance in automotive environments | Feb. 10, 2016 | |
Application note | ESD Layout Guide | Mar. 04, 2015 | |
User guide | TPD5E003DPF EVM User's Guide | Feb. 14, 2013 | |
Application note | Design Considerations for System-Level ESD Circuit Protection | Sep. 25, 2012 | |
User guide | ESD PROTECTION DIODES EVM | Mar. 26, 2012 | |
Application note | Reading and Understanding an ESD Protection Datasheet | May 19, 2010 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The âESD EVMâ features a series of ESD protection diodes and can be used for destructive electrostatic discharge (ESD) pass/fail ESD strike, continuity, and signal pass-through tests. Specifically, it could be used for both IEC-61000-4-2 air and contact discharge tests. The procedure outlined (...)
Features
- Straight through routing
- Two test points per device for simultaneous ESD strike and Vclamp waveform capture
- Additional 2 unnamed footprints (0402 and 0201)
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
X2SON (DPF) | 6 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.