Product details

Number of channels 6 IO capacitance (typ) (pF) 1.6 Vrwm (V) 5.5 IEC 61000-4-2 contact (±V) 8000 Bi-/uni-directional Uni-Directional Interface type USB 2.0 Clamping voltage (V) 20 Rating Catalog Operating temperature range (°C) -40 to 85
Number of channels 6 IO capacitance (typ) (pF) 1.6 Vrwm (V) 5.5 IEC 61000-4-2 contact (±V) 8000 Bi-/uni-directional Uni-Directional Interface type USB 2.0 Clamping voltage (V) 20 Rating Catalog Operating temperature range (°C) -40 to 85
UQFN (RSE) 8 2.25 mm² 1.5 x 1.5
  • ESD Protection Exceeds JESD
    • ±15-kV Human-Body Model (HBM)
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±12-kV IEC 61000-4-2 Air-Gap Discharge
  • Low 1.6-pF I/O Capacitance
  • 0.9-V to 5.5-V Supply-Voltage Range
  • 6-Channel Device
  • Space-Saving UQFN (RSE) Package
  • ESD Protection Exceeds JESD
    • ±15-kV Human-Body Model (HBM)
    • ±8-kV IEC 61000-4-2 Contact Discharge
    • ±12-kV IEC 61000-4-2 Air-Gap Discharge
  • Low 1.6-pF I/O Capacitance
  • 0.9-V to 5.5-V Supply-Voltage Range
  • 6-Channel Device
  • Space-Saving UQFN (RSE) Package

The TPD6E004 device is a low-capacitance, ±15-kV ESD-protection diode array designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steers ESD current pulses to VCC or GND. The TPD6E004 protects against ESD pulses up to ±15-kV human-body model (HBM), ±8-kV contact ESD, and ±12-kV air-gap ESD as specified in IEC 61000-4-2. This device has a typical 1.6-pF capacitance per channel, making it ideal for use in high-speed data I/O interfaces.

The TPD6E004 device is available in the RSE package and is specified for –40°C to +85°C operation.

The TPD6E004 device is a six-channel ESD structure designed for USB, Ethernet, and FireWire applications.

The TPD6E004 device is a low-capacitance, ±15-kV ESD-protection diode array designed to protect sensitive electronics attached to communication lines. Each channel consists of a pair of diodes that steers ESD current pulses to VCC or GND. The TPD6E004 protects against ESD pulses up to ±15-kV human-body model (HBM), ±8-kV contact ESD, and ±12-kV air-gap ESD as specified in IEC 61000-4-2. This device has a typical 1.6-pF capacitance per channel, making it ideal for use in high-speed data I/O interfaces.

The TPD6E004 device is available in the RSE package and is specified for –40°C to +85°C operation.

The TPD6E004 device is a six-channel ESD structure designed for USB, Ethernet, and FireWire applications.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Type Title Date
* Data sheet TPD6E004 Low-Capacitance, 6-Channel ±15-kV ESD Protection Array for High-Speed Data Interfaces datasheet (Rev. B) PDF | HTML 27 Apr 2016
Selection guide System-Level ESD Protection Guide (Rev. D) 07 Sep 2022
More literature ESD Protection Layout Guide (Rev. A) PDF | HTML 07 Apr 2022
Technical article Benefits of using Sub-1 GHz connectivity for grid asset monitoring, protection and control 28 May 2020
Selection guide System-Level ESD Protection Guide (Rev. C) 20 Feb 2018
More literature Designing USB for short-to-battery tolerance in automotive environments 10 Feb 2016
Analog Design Journal Design Considerations for System-Level ESD Circuit Protection 25 Sep 2012
More literature Reading and Understanding an ESD Protection Datasheet 19 May 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

LAUNCHXL-CC1350-4 — CC1350 dual-band Launchpad™ for multiprotocol Sub-1 GHz and 2.4 GHz SimpleLink™ wireless MCU

The SimpleLink™ CC1350 wireless microcontroller (MCU) LaunchPad™ development kit combines a 433 MHz with a Bluetooth® low energy radio for the ultimate combination of easy mobile phone integration with long-range connectivity including a 32-bit ARM® Cortex®-M3 processor on a (...)

User guide: PDF
Not available on TI.com
Evaluation board

LAUNCHXL-F280049C — F280049C LaunchPad™ development kit C2000™ Piccolo™ MCU

LAUNCHXL-F280049C is a low-cost development board for TI C2000™ Real-Time Controllers series of F28004x devices. Ideal for initial evaluation and prototyping, it provides a standardized and easy to use platform to develop your next application. This extended version LaunchPad offers extra (...)
User guide: PDF
Not available on TI.com
Evaluation board

LP87642Q1EVM — LP87642-Q1 evaluation module for four-phase one output functional safety compliant buck converter

The LP87642Q1EVM board can be used to test, demo, debug and configure one or more LP8764-Q1 power managements ICs for automotive and industrial applications. The device on board is LP876411E2RQRQ1 which has 4-phase 2.2 MHz configuration for one high current multiphase rail. The EVM boards can be (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

LP87644Q1EVM — LP87644-Q1 evaluation module for four-output buck converter

The LP87644Q1EVM board can be used to test, demo, debug and configure one or more LP8764-Q1 power managements ICs for automotive and industrial applications. The device on board is LP876441E4RQKRQ1 which has 1+1+1+1-phase configuration for 4 different output voltage rails. The boards can be (...)
User guide: PDF | HTML
Not available on TI.com
Development kit

MSP-EXP432E401Y — MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU

The SimpleLink™ Ethernet MSP432E401Y microcontroller LaunchPad™ Development Kit is an intuitive evaluation platform for SimpleLink™ Arm® Cortex®-M4F-based Ethernet MCUs. The Ethernet LaunchPad development kit highlights the MSP432E401Y MCU with integrated Ethernet MAC and (...)

User guide: PDF | HTML
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Reference designs

TIDA-010032 — Universal data concentrator reference design supporting Ethernet, 6LoWPAN RF mesh & more

IPv6-based grid communications are becoming the standard choice in industrial markets and applications like smart meters and grid automation. The universal data concentrator design provides a complete IPv6-based network solution integrated with Ethernet backbone communication, 6LoWPAN RF mesh (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-010024 — Secured 6LoWPAN mesh end-node with enhanced network capacity reference design

This reference design implements an RF mesh network end node with DTLS security for smart meter Advanced Metering Infrastructure (AMI) networks. The network is an IPv6 over low-power wireless personal area networks (6LoWPAN) solution. The design implements this network in a single CC1312R (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-010003 — Simple 6LoWPAN mesh end-node improves network performance reference design

This reference design implements a simple RF mesh network end node for smart meter Advanced Metering Infrastructure (AMI) networks. The network is an IPv6 over low-power wireless personal area networks (6LoWPAN) solution. The design implements this network in a single CC1310 SimpleLink™ (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-00816 — Grid IoT Reference Design: Connecting Fault Indicators, Data Collector, Mini-RTU Using Sub-1GHz RF

The TIDA-00816 reference design has wireless sub-1 GHz communication in a star network between multiple sensor nodes (in this case, fault passage indicators) and a collector using the TI 15.4-stack. This design is optimized for low power consumption for short range (< 50 m) using overhead fault (...)
Design guide: PDF
Schematic: PDF
Package Pins Download
UQFN (RSE) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos