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UC3610

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Dual schottky diode bridge with 3-A peak forward current

Product details

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PDIP (P) 8 92.5083 mm² 9.81 x 9.43 SOIC (DW) 16 106.09 mm² 10.3 x 10.3
  • Monolithic Eight-Diode Array
  • Exceptional Efficiency
  • Low Forward Voltage
  • Fast Recovery Time
  • High Peak Current
  • Small Size
  • Monolithic Eight-Diode Array
  • Exceptional Efficiency
  • Low Forward Voltage
  • Fast Recovery Time
  • High Peak Current
  • Small Size

This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.

The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.

This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.

This eight-diode array is designed for high-current, low duty-cycle applications typical of flyback voltage clamping for inductive loads. The dual bridge connection makes this device particularly applicable to bipolar driven stepper motors.

The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.

This single monolithic chip is fabricated in both hermetic CERDIP and copper-leaded plastic packages. The UC1610 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability. The UC2610 in plastic and ceramic is designed for -25°C to 125°C environments also with reduced peak current capability; while the UC3610 in plastic has higher current rating over a 0°C to 70°C temperature range.

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Technical documentation

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Type Title Date
* Data sheet Dual Schottky Diode Bridge datasheet (Rev. B) 07 Dec 2004
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 27 Sep 2021

Design & development

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Evaluation board

ESDEVM — Generic ESD Evaluation Module

Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For (...)
User guide: PDF | HTML
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Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Package Pins Download
PDIP (P) 8 View options
SOIC (DW) 16 View options

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