CD4504B-MIL

AKTIV

CMOS-Hex-Spannungspegelumsetzer für TTL-zu-CMOS- oder CMOS-zu-CMOS-Betrieb

Produktdetails

Technology family CD4000 Bits (#) 6 Configuration 6 Ch B to A 0 Ch A to B High input voltage (min) (V) 2 High input voltage (max) (V) 18 Vout (min) (V) 0 Vout (max) (V) 18 Data rate (max) (Mbps) 24 IOH (max) (mA) -6.8 IOL (max) (mA) -6.8 Supply current (max) (µA) 18 Features 135.3552 Input type TTL-Compatible CMOS Output type Balanced CMOS, Push-Pull Rating Military Operating temperature range (°C) -55 to 125
Technology family CD4000 Bits (#) 6 Configuration 6 Ch B to A 0 Ch A to B High input voltage (min) (V) 2 High input voltage (max) (V) 18 Vout (min) (V) 0 Vout (max) (V) 18 Data rate (max) (Mbps) 24 IOH (max) (mA) -6.8 IOL (max) (mA) -6.8 Supply current (max) (µA) 18 Features 135.3552 Input type TTL-Compatible CMOS Output type Balanced CMOS, Push-Pull Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 16 135.3552 mm² 19.56 x 6.92
  • Independence of power-supply sequence considerations - VCC can exceed VDD; input signals can exceed both VCC and VDD
  • Up and down level-shifting capability
  • Shiftable input threshold for either CMOS or TTL compatibility
  • Standardized symmetrical output characteristics
  • 100% tested for quiescent current @ 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5V, 10 V, and 15 V parametric ratings
  • Meets all requirements of JEDEC Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor.

  • Independence of power-supply sequence considerations - VCC can exceed VDD; input signals can exceed both VCC and VDD
  • Up and down level-shifting capability
  • Shiftable input threshold for either CMOS or TTL compatibility
  • Standardized symmetrical output characteristics
  • 100% tested for quiescent current @ 20 V
  • Maximum input current of 1 µA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
  • 5V, 10 V, and 15 V parametric ratings
  • Meets all requirements of JEDEC Standard No. 13B, "Standard Specifications for Description of ’B’ Series CMOS Devices"

Data sheet acquired from Harris Semiconductor.

CD4504B hex voltage level-shifter consists of six circuits which shift input signals from the VCC logic level to the VDD logic level. To shift TTL signals to CMOS logic levels, the SELECT input is at the VCC HIGH logic state. When the SELECT input is a LOW logic state, each circuit translates signals from one CMOS level to another.

The CD4504B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

CD4504B hex voltage level-shifter consists of six circuits which shift input signals from the VCC logic level to the VDD logic level. To shift TTL signals to CMOS logic levels, the SELECT input is at the VCC HIGH logic state. When the SELECT input is a LOW logic state, each circuit translates signals from one CMOS level to another.

The CD4504B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix), 16-lead small-outline packages (M, M96, and MT suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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Technische Dokumentation

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Alle anzeigen 10
Typ Titel Datum
* Data sheet CD4504B TYPES datasheet (Rev. D) 09 Nov 2004
Application note Understanding Transient Drive Strength vs. DC Drive Strength in CMOS Output Buffers PDF | HTML 14 Mai 2024
Application brief Leveraging TXH for High Voltage Level Shifting PDF | HTML 28 Jul 2023
Selection guide Voltage Translation Buying Guide (Rev. A) 15 Apr 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Understanding Buffered and Unbuffered CD4xxxB Series Device Characteristics 03 Dez 2001

Design und Entwicklung

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CDIP (J) 16 Optionen anzeigen

Bestellen & Qualität

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  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
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