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CSD95490Q5MC

NICHT FÜR NEUE DESIGNS EMPFOHLEN

Synchrone intelligente NexFET™-Abwärtsleistungsstufe (Buck), 75 A, mit DualCool-Gehäuse

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Datenblatt
CSD95490Q5MC wird nicht für neue Designs empfohlen
Dieses Produkt ist weiterhin für Bestandskunden erhältlich. Neue Designs sollten ein alternatives Produkt erwägen.
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Selbe Funktionalität wie der verglichene Baustein bei abweichender Anschlussbelegung
CSD95410RRB AKTIV Intelligente NexFET™-Leistungsstufe für synchronen Abwärtswandler mit 90 A Spitzenstrom Improved device current rating and efficiency in an industry standard common footprint 5-mm x 6-mm package.

CSD95490Q5MC

NICHT FÜR NEUE DESIGNS EMPFOHLEN
Datenblatt Jetzt bestellen

Produktdetails

VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VDS (V) 20 Ploss current (A) 30 Rating Catalog Operating temperature range (°C) -55 to 150
VSON-CLIP (DMC) 12 30 mm² 6 x 5
  • 75-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • 75-A Continuous Operating Current Capability
  • Over 95% System Efficiency at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Function
  • Temperature Compensated Bi-Directional Current Sense
  • Analog Temperature Output
  • Fault Monitoring
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Switch
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density QFN 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System Optimized PCB Footprint
  • Thermally Enhanced Topside Cooling
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD95490Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95490Q5MC NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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Weitere Informationen und Musterverfügbarkeit

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Technische Dokumentation

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Typ Titel Datum
* Data sheet CSD95490Q5MC Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) PDF | HTML 09 Jan 2018

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort