CY54FCT574T

AKTIV

Flankengesteuerte Achtfach-Flipflops (Typ D) mit Tri-State-Ausgängen

Produktdetails

Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Technische Dokumentation

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Typ Titel Datum
* Data sheet 8-Bit Registers With 3-State Outputs datasheet 11 Okt 2001
* SMD CY54FCT574T SMD 5962-92222 21 Jun 2016
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dez 2022
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dez 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide CYFCT Parameter Measurement Information 02 Apr 2001
Selection guide Advanced Bus Interface Logic Selection Guide 09 Jan 2001

Design und Entwicklung

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Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
CDIP (J) 20 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

Bestellen & Qualität

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  • Materialinhalt
  • Qualifikationszusammenfassung
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  • Werksstandort
  • Montagestandort

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